DFI BT101 - Manual (Page 11)

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11
Chapter 2 Hardware Installation
Chapter 2
Installing the Heat Sink
The CPU must be kept cool by using a CPU fan with heat sink. Without sufficient air circula-
tion across the CPU and heat sink, the CPU will overheat damaging both the CPU and system
board.
1. On the solder side of the board, match the retention module base to the mounting holes
around the CPU socket.
Retention module base
2. Turn to the component side of the board making sure the retention module base is posi-
tioned and fitted properly under the board.
3. Apply a thin layer of thermal paste on top of the CPU. Do not spread the paste all over
the surface. When you later place the heat sink on top, the compound will disperse evenly.
6. Push down the module until the clips at each end of the socket lock into position. You will
hear a distinctive “click”, indicating the module is correctly locked into position.
Clip
5. Grasping the module by its edges, align the module into the socket at an approximately 30
degrees angle. Apply firm even pressure to each end of the module until it slips down into
the socket. The contact fingers on the edge of the module will almost completely disappear
inside the socket.
Clip
Important:
When installing one DDR3L SODIMM only, make sure to install it into the SODIMM 1
socket.