1 product specifications – Foxconn H55M-S User Manual

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1-1 Product Specifications

CPU

Support LGA 1156 socket Intel® CPU, Max processor power up to 95w

For the latest CPU information, please visit:

http://www.foxconnsupport.com/cpusupportlist.aspx

Chipset

Intel® H55

Memory

4 x 240-pin DDR3 DIMM sockets
Support up to 16GB of system memory
Dual channel DDR3 1600(oc*)/1333/1066 MHz architecture
(oc:Overclocking)

Expansion Slots

1 x PCI Express x16 slot
1 x PCI Express x1 slot
2 x PCI slots

VGA

Integrated Graphics Support with PAVP 1.5
Dual independent displays support with DVI-D and D-Sub

Storage

H55 chipset:
- 6 x SATA connectors
300MB/s data transfer rate
- Support hot plug and NCQ (Native Command Queuing)

LAN

Giga Lan RTL8111DL

Audio

ALC662/ALC888S,
- High Definition Audio
- 2/4/5.1/7.1(ALC888S)-channel
- Support for S/PDIF OUT
- Support Jack- Sensing function

USB

Support hot plug
Supports up to 12 x USB 2.0 ports (6 rear panel ports, 3 onboard USB
headers supporting 6 extra ports
Support USB 2.0 protocol up to 480Mb/s

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