Document Outline

• COMX-P40x0 ENP2
• Contents
• About this Manual
  • Overview of Contents
  • Abbreviations
  • Conventions
  • Summary of Changes
• Introduction
  • 1.1 Overview
  • 1.2 Standard Compliances
  • 1.3 Mechanical Data
    • 1.3.1 COMX-P4080 ENP2
    • 1.3.2 COMX-P4040 ENP2
  • 1.4 Ordering Information
  • 1.5 Product Identification
    • 1.5.1 COMX-P4080 ENP2
    • 1.5.2 COMX-P4040 ENP2
• Hardware Preparation and Installation
  • 2.1 Environmental and Power Requirements
    • 2.1.1 Environmental Requirements
  • 2.2 Unpacking and Inspecting the Enclosure
  • 2.3 Installing and Removing the Module on the Carrier Board
• Controls, LEDs, and Connectors
  • 3.1 Connectors and Switches
    • 3.1.1 On-Board Connectors
    • 3.1.2 ON-BOARD LEDS
    • 3.1.3 COMX AB-CD Connectors
• Functional Description
  • 4.1 Overview
  • 4.2 Block Diagram
  • 4.3 Processor Core and Cache Memory Complex
  • 4.4 Integrated Memory Controller
  • 4.5 Local Bus
    • 4.5.1 Clock
    • 4.5.2 NOR FLASH
    • 4.5.3 NAND FLASH
  • 4.6 SERDES Block
  • 4.7 Thermal Management
  • 4.8 Main Memory
    • 4.8.1 Memory Interface
    • 4.8.2 Memory Map
  • 4.9 GPIO
  • 4.10 SDHC
  • 4.11 SPI Interface
  • 4.12 LAN
    • 4.12.1 MDIO
  • 4.13 PHY
  • 4.14 UART Interface
  • 4.15 Real Time Clock
  • 4.16 Watchdog Timer
  • 4.17 USB
  • 4.18 I2C Interface
    • 4.18.1 I2C Device Thermal Sensor
    • 4.18.2 I2C Device EEPROM
    • 4.18.3 I2C Device WDT
    • 4.18.4 I2C Device RTC
    • 4.18.5 I2C Device Clock Generators
• Clock Structure
  • 5.1 Overview
• Power Domains
  • 6.1 Overview
  • 6.2 Power Controlling Sequence
• BSP
  • 7.1 Overview
  • 7.2 Setup Requirements
  • 7.3 Basic Commands
  • 7.4 BSP Build Requirements
    • 7.4.1 Install Build Tools of SDK1.0
  • 7.5 BSP Source Code Package
    • 7.5.1 De-Compose Source Code Package
  • 7.6 Basic Environment Variable Settings
    • 7.6.1 Setup Build Environment
    • 7.6.2 Network Variables
    • 7.6.3 Filename Variables for BSP Components
    • 7.6.4 Address Variables for BSP Components on NOR Flash
    • 7.6.5 Address Variables for the Boot Components in RAM
    • 7.6.6 Device Variables
    • 7.6.7 HWCONFIG Variable
    • 7.6.8 Bootargs Variable
    • 7.6.9 Bootup Variables
  • 7.7 Checking the BSP Version
  • 7.8 CPU
  • 7.9 Address Space
  • 7.10 DDR3 SDRAM
  • 7.11 GPIO
  • 7.12 UART
  • 7.13 NOR Flash
  • 7.14 NAND Flash
  • 7.15 I2C
    • 7.15.1 ID EEPROM
    • 7.15.2 Board EEPROM
    • 7.15.3 Real Time Clock (RTC) and Watchdog Timer (WDT)
    • 7.15.4 DTT
  • 7.16 SPI
  • 7.17 MMC/SDHC
  • 7.18 USB
  • 7.19 SerDes
  • 7.20 Network
  • 7.21 Build BSP Images
    • 7.21.1 Build U-Boot
    • 7.21.2 Build Linux Kernel
    • 7.21.3 Build ROOTFS
    • 7.21.4 Build Misc Firmware
  • 7.22 Deploy BSP Images
    • 7.22.1 Pre-Deployment Steps
    • 7.22.2 Deploying BSP Images on NOR FLASH
  • 7.23 Boot
    • 7.23.1 RAMboot
    • 7.23.2 NORboot
    • 7.23.3 NANDboot
    • 7.23.4 NFSboot
    • 7.23.5 USBFATboot and USBEXT2boot
    • 7.23.6 MMCFATboot and MMCEXT2boot
• A Related Documentation
  • A.1 Artesyn Embedded Technologies - Embedded Computing Documentation
• Safety Notes