Document Outline

• GENERAL DESCRIPTION
  • SPECIFICATIONS
• U
• UNPACKING, INSPECTION AND BENCH CHECKOUT
  • UNPACKING, INSPECTION
  • BENCH CHECKOUT
• SIMPLIFIED OPERATION
  • SAMPLE PROCESS
• DETAILED OPERATION
  • INTRODUCTION AND GENERAL CONCEPTS
  • DISPLAYS
  • BUTTONS
  • OPERATION
    • Monitor Operating States
      • Electroless plating
        • Ready State
        • Preplate State
        • Plate State
        • Deplate State
        • Endpoint State
      • Electrolytic plating
        • Ready State
        • Plate State
        • Deplate State
        • Endpoint State
    • Monitor Measurement Modes
      • Single Probe Measurement Modes
        • Continuous
        • Sample
        • Sample with Deplate
      • Dual Probe Measurement Modes
        • Auto Probe Swap
        • Alternating Measurement mode
        • Dual Probe Measurement mode
    • Probe States and Modes
      • Probe States
        • Failed state.
        • Standby state
        • Active state
      • Probe modes
        • Ready mode
        • Hold mode
        • Deplate mode
        • Preplate mode
        • Plate mode
    • Main Display modes
      • Rate and Thickness
      • Rate and Efficiency
      • Efficiency and Thickness
      • Frequency
    • Parameter/Status Display modes
      • Status Display
      • Frequency Display
      • Elapsed Time Display
      • Time to Go Display
      • Current Density Display
      • A-B)% Display
    • Simulation Mode
  • PARAMETERS
    • Viewing and modifying
    • Hidden parameters
    • Descriptions
      • Mode Menu
      • Display Menu
      • Setup Menu
    • Restoring to Default Values
  • STATUS ASSESSMENT
    • Monitor Status
    • Probe Status
  • SWAPPING PROBES
    • Manual probe swapping
      • Assessing the probe status prior to initiating the swap.
      • Preplating prior to swapping.
      • Commanding the swap.
      • Deplating the Standby Probe.
      • Manual termination of Preplate or Deplate on the Standby probe.
    • Automatic probe swapping
      • Auto probe swap on active probe failure.
      • Alternating Probe mode.
      • Failed Standby Probe inhibits automatic swap.
  • EXTERNAL INTERFACE
    • Discrete Inputs
    • Discrete Outputs
    • Digital to Analog Converters
      • Thickness DAC
      • Rate DAC
    • Computer Connection
      • RS-232 Interface
      • Protocol
      • Remote Control
        • Upload Parameter Store (Instruction 10h)
        • Restore Parameter Store (Instruction 20h)
        • Remotely Activate (Instruction 30h)
      • Remote Monitoring
        • Upload Machine Status (Instruction 40h)
      • Data Logging
        • Establish automatic data logging
        • Single data log
• T
• TROUBLESHOOTING
  • TROUBLE-SHOOTING AIDS
  • FAIL MESSAGES FOLLOWING POWER ON
    • Power Failure
    • Sensor Probe Failure
    • Invalid Parameters
    • RAM Failure
    • ROM Failure
  • PROBE FAILED INDICATION
• A
• APPENDIX
  • THEORY OF THE QUARTZ CRYSTAL MICROBALANCE
    • Crystal Frequency
    • Crystal Health Calculation
    • Thickness Calculation
    • Rate Calculation
  • FINE TUNING WITH EMPIRICAL CALIBRATION
    • Density
    • Tooling Factor
    • Acoustic Impedance
  • LIST OF MATERIAL CONSTANTS