Document Outline

• 1 User Information
  • 1.1 About This Document
  • 1.2 Copyright Notice
  • 1.3 Trademarks
  • 1.4 Standards
  • 1.5 Warranty
  • 1.6 Technical Support
• 2 Introduction
  • 2.1 Product Description
  • 2.2 Naming clarification
  • 2.3 Understanding COM Express® Functionality
  • 2.4 COM Express® Documentation
  • 2.5 COM Express® Benefits
• 3 Product Specification
  • 3.1 Module definition
  • 3.2 Functional Specification
    • Processor
    • CPU Features
    • Memory
    • Chipset
      • PCH comparison
      • HighSpeed I/O Port Configuration
    • Graphics Core
      • Monitor output
      • LVDS
      • Display Interfaces
      • PEG Configuration
    • Storage
    • Connectivity
      • PCI Express Configuration
      • Ethernet
    • Misc Interfaces and Features
    • Kontron Features
    • Additional features
    • Power Features
    • Power Consumption and Performance
  • 3.3 Block Diagram
  • 3.4 Accessories
  • 3.5 Electrical Specification
    • 3.5.1 Supply Voltage
    • 3.5.2 Power Supply Rise Time
    • 3.5.3 Supply Voltage Ripple
    • 3.5.4 Power Consumption
    • 3.5.5 ATX Mode
    • 3.5.6 Single Supply Mode
  • 3.6 Power Control
    • Power Supply
    • Power Button (PWRBTN#)
    • Power Good (PWR_OK)
    • Reset Button (SYS_RESET#)
    • SM-Bus Alert (SMB_ALERT#)
  • 3.7 Environmental Specification
    • 3.7.1 Temperature Specification
    • 3.7.2 Humidity
  • 3.8 Standards and Certifications
    • RoHS II
    • Component Recognition UL 60950-1
    • WEEE Directive
    • Conformal Coating
    • Shock & Vibration
    • EMC
  • 3.9 MTBF
  • 3.10 Mechanical Specification
    • Dimension
    • Height
  • 3.11 Module Dimensions
  • 3.12 Thermal Management, Heatspreader and Cooling Solutions
  • 3.13 Onboard Connectors
    • 3.13.1 FAN Connector J6 - PCB bottom
    • 3.13.2 CPU JTAG connector J3 - PCB bottom
    • 3.13.3 CPLD Debug connector J7 - PCB top
• 4 Features and Interfaces
  • 4.1 S5 Eco Mode
  • 4.2 Rapid Shutdown
    • Overview
    • Crowbar implementation details
    • Shutdown input circuit details
  • 4.3 LPC
  • 4.4 Serial Peripheral Interface (SPI)
  • 4.5 SPI boot
    • Recommended SPI boot flash types for 8-SOIC package
    • Using an external SPI flash
    • External SPI flash on Modules with Intel® ME
  • 4.6 M.A.R.S.
  • 4.7 UART
  • 4.8 Fast I2C
  • 4.9 Dual Staged Watchdog Timer
    • Basics
    • Time-out events
    • WDT Signal
  • 4.10 Intel® Fast Flash Standby™ / Rapid Start Technology™
  • 4.11 Speedstep Technology
  • 4.12 C-States
  • 4.13 Hyper Threading
  • 4.14 Dynamic FSB Frequency Switching
  • 4.15 VID-x
  • 4.16 Intel® Turbo Boost Technology and AVX
  • 4.17 Display Configuration
    • Maximum supported Resolutions in Single Display Configuration
    • Maximum supported Pixel Clock
    • DDI supported resolutions in 3 Display Configurations
    • Link Data Rate
    • 3 independent Display Support
    • Digital Display Interface Features
    • Supported Audio Formats on HDMI and DisplayPort
    • DDI Design Consideration
    • DVI-I Design Topology
  • 4.18 Hybrid Graphics / Multi-monitor
    • Requirements
    • Setup a Multi-monitor system
  • 4.19 Intel® Wireless Display
  • 4.20 Intel® vPro™ technology
  • 4.21 ACPI Suspend Modes and Resume Events
• 5 System Resources
  • 5.1 Interrupt Request (IRQ) Lines
  • 5.2 Memory Area
  • 5.3 I/O Address Map
  • 5.4 Peripheral Component Interconnect (PCI) Devices
  • 5.5 Internal I2C Bus
  • 5.6 External I2C Bus
  • 5.7 System Management (SM) Bus
• 6 Connectors
  • 6.1 Connector Location
• 7 Pinout List
  • 7.1 General Signal Description
  • 7.2 Connector X1A Row A
  • 7.3 Connector X1A Row B
  • 7.4 Connector X1B Row C
  • 7.5 Connector X1B Row D
• 8 BIOS Operation
  • 8.1 Determining the BIOS Version
  • 8.2 BIOS Update
  • 8.3 POST Codes
  • 8.4 Setup Guide
    • Menu Bar
    • Legend Bar
    • Selecting an Item
    • Displaying Submenus
    • Item Specific Help Window
    • General Help Window
  • 8.5 BIOS Setup
    • 8.5.1 Main
      • System Information
      • Boot Features
      • Network Stack
      • Platform Information
    • 8.5.2 Advanced
      • Silicon Information
      • Processor Configuration
        • Processor Power Management
      • Miscellaneous
        • I2C Speed
        • Watchdog
        • Generic LPC Decode Ranges
      • H/W Monitor
      • HDD Configuration
        • Software Feature Mask Configuration
      • Memory Configuration
      • System Agent (SA) Configuration
        • Intel® VT for Directed I/O (VT-d)
        • Graphics Configuration
        • IGD Configuration
        • PEG Port Configuration
      • South Bridge Configuration
        • SB PCI Express Config
        • PCI Express Root Port 0/1/2/3/4/5/6
        • SB USB Config
        • SB Azalia Config
      • Network Configuration
      • CPLD Configuration
      • LPC SIO Configuration
      • AMT Configuration (vPRO Version only)
        • MEBx Resolution Setting (vPRO Version only)
      • ME Configuration (default)
      • ME Configuration (vPRO Version only)
      • Thermal Configuration
        • CPU Thermal Configuration
        • Platform Thermal Configuration
        • Passive Cooling
      • ICC Configuration
        • Clock 3
      • Intel® Rapid Start Technology
      • Intel® Smart Connect Technology
    • 8.5.3 Security
      • Security
    • 8.5.4 Boot
    • 8.5.5 Exit