Compactpci, Product overview, Icp-piii – Inova High Performance CPU board ICP-PII User Manual

Page 15

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©2002 Inova Computers GmbH

Page 1-5

Doc. PD00581013.004

ICP-PIII

Product Overview

CompactPCI

®

1

PCI/PCI

Intel 21150 transparent bridge (Master) or Intel 21554 non-transpar-
ent PCI/PCI bridge for multiprocessing (Slave) operation with Basic
Hot-Swap support (PICMG 2.1 R1.0), Serialized interrupts and univer-
sal (3.3/5.0V) V I/O support

On-Board I/O

Ī

10/100 MBit/s Ethernet (Intel 82559)

Ī

optional 2nd independent Fast Ethernet

Ī

Up to 2x 12Mbit/s USB

Ī

Up to 2x 400Mbit/s FireWire interfaces

Rear I/O

Standard to all CPU variants is option ‘C’ which provides 2nd FireWire
channel, 2nd USB channel, LPT1 (Floppy), EIDE and loudspeaker.
Other I/O configurations including customized are possible.

Mass Storage

1.44MByte 3.5” floppy drive and EIDE (flex cable/rear I/O) support-
ing 2 pairs (Master/Slave) hard-disks or CD ROMs

Front-Panels

Optional 4TE front-panel extension provides:
COM1, COM2, keyboard, PS-2 mouse

Extended front-panel (4TE) provides:
COM2, LPT1

Connectors

USB (USB), RJ45 (Ethernet), 6-pin FireWire (FireWire), 15-pin D-Sub
(PanelLink), 15-pin high-density D-Sub (VGA), 9-pin D-Sub
(GigaST

Ȣ

R)

CompactPCI

PICMG 2.0 R3.0, 32-bit, 33MHz system slot interface with 7 Master
(DMA) support. Dual-slot operation

Mechanics

3U (100 x 160 x 21mm) 4 TE
3U (100 x 160 x 42mm) 8 TE
3U (100 x 160 x 63mm) 12 TE

Power Cons.

25W typ. PIII @ 850MHz (Lynx)
21W typ. PIII @ 700MHz (Lynx)
12W typ. Mobile PIII @ 500MHz (Lynx)

Software

Windows® NT®, Windows® 2000, Windows® 9x, Linux,

Support

VxWorks®, QNX®

Mass

220g (4TE)

Oper. Temp.

0

°

C to +60

°

C (Ambient)*

Storage Temp.

-40

°

C to +85

°

C (400MHz Mobile [Lynx] only)

Extended Temp.

-40 to +85

°

C (Seleted CPUs only)

Humidity

5% to 95% (non-condensing)

Warranty

Three-year limited warranty

Conformance

PICMG 2.0 R3.0
CE

*Note: Any CPU fitted with HD, FD or CD-ROM etc. has a max. operational temperature of 50

°

C

CPUs without HD or PC inter faces ar e single-slot (4TE) for ‘pr

ocessor speeds

700MHz.

Mobile processors are passively cooled - installation

MUST have >0.3m/s air flow!

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