Package outline, Tda8566, Nxp semiconductors – Philips TDA8566 User Manual

Page 13: 2× 40 w/2 ω stereo btl car radio power amplifier

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TDA8566_6

© NXP B.V. 2007. All rights reserved.

Product data sheet

Rev. 06 — 15 October 2007

13 of 21

NXP Semiconductors

TDA8566

2

×

40 W/2

stereo BTL car radio power amplifier

14. Package outline

Fig 10. Package outline SOT418-3 (HSOP20)

UNIT

A4

(1)

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

+

0.08

0.04

3.5

0.35

DIMENSIONS (mm are the original dimensions)

Notes

1. Limits per individual lead.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

SOT418-3

0

5

10 mm

scale

HSOP20: plastic, heatsink small outline package; 20 leads; low stand-off height

SOT418-3

A

max.

detail X

A2

3.5
3.2

D2

1.1
0.9

HE

14.5
13.9

Lp

1.1
0.8

Q

1.7
1.5

2.5
2.0

v

0.25

w

0.25

y

Z

8

°

0

°

θ

0.07

x

0.03

D1

13.0
12.6

E1

6.2
5.8

E2

2.9
2.5

bp

c

0.32
0.23

e

1.27

D

(2)

16.0
15.8

E

(2)

11.1
10.9

0.53
0.40

A3

A4

A2

(A3)

Lp

θ

A

Q

D

y

x

HE

E

c

v

M

A

X

A

bp

w

M

Z

D1

D2

E2

E1

e

20

11

1

10

pin 1 index

02-02-12
03-07-23

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