Package outline – Philips BGD906 User Manual

Page 8

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2001 Nov 01

8

NXP Semiconductors

Product specification

860 MHz, 21.5 dB gain power doubler
amplifier

BGD906; BGD906MI

PACKAGE OUTLINE

UNIT

A2

max.

c

e

e1

q

Q

max.

q1

q2

U2

U1

W

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

20.8

9.5

0.51
0.38

0.25 27.2

2.04
2.54

13.75 2.54 5.08 12.7 8.8

4.15
3.85

2.4

38.1 25.4 10.2 4.2

44.75
44.25

8.2
7.8

0.25

0.1

3.8

b

F

p

6-32

UNC

y

w

0.7

x

S

DIMENSIONS (mm are the original dimensions)

SOT115J

0

5

10 mm

scale

A

max.

D

max.

L

min.

E

max.

Z

max.

Rectangular single-ended package; aluminium flange; 2 vertical mounting holes;
2 x 6-32 UNC and 2 extra horizontal mounting holes; 7 gold-plated in-line leads

SOT115J

D

U1

q

q2

q1

b

F

S

A

Z

p

E

A2

L

c

d

Q

U2

M

w

7

8

9

2

3

W

e

e1

5

p

1

d

x

M

B

y

M

B

B

04-02-04
10-06-18

y

M

B

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