Package outline, Cgd942c, Nxp semiconductors – NXP Semiconductors CGD942C User Manual

Page 4: Fig 1. package outline sot115j

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CGD942C

All information provided in this document is subject to legal disclaimers.

© NXP B.V. 2010. All rights reserved.

Product data sheet

Rev. 3 — 29 September 2010

4 of 8

NXP Semiconductors

CGD942C

870 MHz, 23 dB gain power doubler amplifier

6. Package

outline

Fig 1.

Package outline SOT115J

UNIT

A2

max.

c

e

e1

q

Q

max.

q1

q2

U2

U1

W

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

20.8

9.5

0.51
0.38

0.25 27.2

2.04
2.54

13.75 2.54 5.08 12.7 8.8

4.15
3.85

2.4

38.1 25.4 10.2 4.2

44.75
44.25

8.2
7.8

0.25

0.1

3.8

b

F

p

6-32

UNC

y

w

0.7

x

S

DIMENSIONS (mm are the original dimensions)

SOT115J

0

5

10 mm

scale

A

max.

D

max.

L

min.

E

max.

Z

max.

Rectangular single-ended package; aluminium flange; 2 vertical mounting holes;
2 x 6-32 UNC and 2 extra horizontal mounting holes; 7 gold-plated in-line leads

SOT115J

D

U1

q

q2

q1

b

F

S

A

Z

p

E

A2

L

c

d

Q

U2

M

w

7

8

9

2

3

W

e

e1

5

p

1

d

x

M

B

y

M

B

B

04-02-04
10-06-18

y

M

B

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