Package outline, Sot141-6 – NXP Semiconductors TDA8560Q User Manual

Page 15

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1996 Jan 08

15

Philips Semiconductors

Product specification

2

×

40 W/2

stereo BTL car radio

power amplifier with diagnostic facility

TDA8560Q

PACKAGE OUTLINE

UNIT

A

e

1

A

2

b

p

c

D

(1)

E

(1)

Z

(1)

d

e

D

h

L

L

3

m

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

mm

17.0
15.5

4.6
4.2

0.75
0.60

0.48
0.38

24.0
23.6

20.0
19.6

10

3.4

v

0.8

12.2
11.8

1.7

e

2

5.08

2.4
1.6

E

h

6

2.00
1.45

2.1
1.8

3.4
3.1

4.3

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

12.4
11.0

SOT141-6

0

5

10 mm

scale

Q

j

0.25

w

0.03

x

D

L

E

A

c

A

2

m

L

3

Q

w

M

b

p

1

d

D

Z

e

2

e

e

x

h

1

13

j

Eh

non-concave

view B: mounting base side

92-11-17
95-03-11

DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm)

SOT141-6

v

M

B

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