3 board stack-up, Evm configuration and description – Texas Instruments TS3USB221 User Manual

Page 6

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EVM Configuration and Description

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3.3

Board Stack-Up

Table 3

shows the board stack-up.

Table 3. Board Stack-Up

Subclass

Thickness

Dielectric

Loss

Width

Impedance

Coupling

Spacing

Diff Z

o

Type

Shield

Name

(mils)

Constant

Tangent

(mils)

(

)

Type

(mils)

(

)

1

SURFACE

2

TOP

CONDUCTOR

2.4

1

0

7.5

47.72

EDGE

7.5

85.004

3

DIELECTRIC

4

4.1

0.035

4

GND

PLANE

1.2

1

0

YES

5

DIELECTRIC

48

4.1

0.035

6

VCC

PLANE

1.2

1

0

YES

7

DIELECTRIC

4

4.1

0.035

7.5

47.72

EDGE

7.5

85.004

8

BOTTOM

CONDUCTOR

2.4

1

0

9

SURFACE

6

TS3USB221/A/E High Speed USB 2.0 (480 Mbps) 1:2 Multiplexer/Demultiplexer

SCDU001A – July 2009 – Revised October 2009

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