Cpsm, Vishay dale – C&H Technology CPSM User Manual

Page 2

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Document Number: 30106

For technical questions, contact: [email protected]

www.vishay.com

Revision: 27-Jun-07

317

CPSM

Vishay Dale

Wirewound Resistors, Commercial Power, Surface Mount

DIMENSIONS

L

0.080

[2.03]

Maximum

L1

0.020 ± 0.005

[0.508 ± 0.127]

W

H

W1

a

I

b

MODEL

DIMENSIONS in inches [millimeters]

L

± 0.032

[0.813]

W

± 0.031

[0.787]

L

1

± 0.062

[1.57]

W

1

+ 0.032

[0.813]
- 0.012
[0.305]

H

± 0.031

[0.787]

CPSM03

0.906

[23.01]

0.374
[9.50]

0.480

[12.19]

0.287
[7.29]

0.374
[9.50]

CPSM05

1.060

[26.92]

0.374
[9.50]

0.590

[14.99]

0.287
[7.29]

0.374
[9.50]

MODEL

SOLDER PAD DIMENSIONS in inches

[millimeters]

a

b

l

CPSM03

0.420

[10.67]

0.340
[8.64]

0.380
[9.65]

CPSM05

0.440

[11.18]

0.340
[8.64]

0.490

[12.45]

Temperature Rise

200

150

100

50

0

0 1.0 2.0

3.0

4.0

5.0

Power in W

CPSM0 3

CPSM0 5

T

e

mperature Rise in

°

C

Derating

120

100

80

60

40

20

0

- 65

- 25

25

75

125

175

225

275

Ambient Te mperature in

°C

40

Rated Power in

%

MATERIAL SPECIFICATIONS

Element

Copper-nickel alloy or nickel-chrome alloy, depending on resistance value

Core

Woven fiberglass

Body

Steatite ceramic case with inorganic potting compound

Terminals

Tin/lead plated steel (Lead (Pb)-free version will be 100 % tin)

Part Marking

DALE, Model, Wattage, Value, Tolerance, Date Code

PERFORMANCE

TEST

CONDITIONS OF TEST

TEST LIMITS (EIA RS-344)

Thermal Shock

- 55 °C to + 165 °C, 5 cycles, 30 minute dwell time

± (5.0 % + 0.05

Ω)

Δ

R

Short Time Overload

5 x rated power for 5 seconds

± (4.0 % + 0.05

Ω)

Δ

R

Dielectric Withstanding Voltage

1000 V

rms

for one minute

± (2.0 % + 0.05

Ω)

Δ

R

Low Temperature Operation

- 65 °C, full rated working voltage for 45 minutes

± (3.0 % + 0.05

Ω)

Δ

R

Humidity

75 °C, 90 % - 100 % RH, 240 hours

± (5.0 % + 0.05

Ω)

Δ

R

Load Life

1000 hours at rated power, + 40 °C, 1.5 hours “ON”, 0.5 hours “OFF”

± (10.0 % + 0.05

Ω)

Δ

R

Resistance to Solder Heat

+ 260 °C solder, 10 - 12 second dwell, 25 mm/second emergence

± (4.0 % + 0.05

Ω)

Δ

R

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