Vishay semiconductors – C&H Technology VSKE91.. Series User Manual

Page 4

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Document Number: 94627

For technical questions, contact:

[email protected]

www.vishay.com

Revision: 09-Mar-11

3

This datasheet is subject to change without notice.

THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

www.vishay.com/doc?91000

VSKD91.., VSKC91.., VSKJ91.., VSKE91.. Series

ADD-A-PAK Generation VII

Power Modules Standard Diodes, 100 A

Vishay Semiconductors

Note

• Table shows the increment of thermal resistance R

thJC

when devices operate at different conduction angles than DC

THERMAL AND MECHANICAL SPECIFICATIONS

PARAMETER

SYMBOL

TEST CONDITIONS

VALUES

UNITS

Junction and storage temperature range

T

J

, T

Stg

- 40 to 150

°C

Maximum internal thermal resistance,
junction to case per leg

R

thJC

DC operation

0.22

°C/W

Typical thermal resistance,
case to heatsink per module

R

thCS

Mounting surface flat, smooth and greased

0.1

Mounting torque ± 10 %

to heatsink

A mounting compound is recommended and the
torque should be rechecked after a period of
3 hours to allow for the spread of the compound.

4

Nm

busbar

3

Approximate weight

75

g

2.7

oz.

Case style

JEDEC

ADD-A-PAK Gen. VII (TO-240AA)

R CONDUCTION PER JUNCTION

DEVICES

SINE HALF WAVE CONDUCTION

RECTANGULAR WAVE CONDUCTION

UNITS

180°

120°

90°

60°

30°

180°

120°

90°

60°

30°

VSK.91

0.057

0.068

0.087

0.12

0.177

0.045

0.073

0.093

0.123

0.178

°C/W

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