Table 1. high-side mosfet losses – Rainbow Electronics MAX15034 User Manual

Page 19

Advertising
background image

MAX15034

ripple current. A low-ESR input capacitor that can han-
dle the maximum input RMS ripple current of one chan-
nel must be used. The maximum RMS capacitor ripple
current is given by:

where I

MAX

is the full load current of the regulator. V

OUT

is the output voltage of the same regulator and C

IN

is C5

in Figure 6. The ESR of the input capacitors wastes
power from the input and heats up the capacitor.
Reducing the ESR is important to maintain a high overall
efficiency and in reducing the heating of the capacitors.

Output Capacitors

The worst-case peak-to-peak inductor ripple current,
the allowable peak-to-peak output ripple voltage, and
the maximum deviation of the output voltage during

step loads determine the capacitance and the ESR
requirements for the output capacitors. The output rip-
ple can be approximated as the inductor current ripple
multiplied by the output capacitor’s ESR (R

ESR_OUT

).

The peak-to-peak inductor current ripple is given by:

During a load step, the allowable deviation of the output
voltage during the fast transient load dictates the output
capacitance and ESR. The output capacitors supply the
load step until the controller responds with a greater duty
cycle. The response time (t

RESPONSE

) depends on the

closed-loop bandwidth of the regulator. The resistive
drop across the capacitor’s ESR and capacitor discharge
causes a voltage drop during a load step. Use a combi-
nation of SP polymer and ceramic capacitors for better
transient load and ripple/noise performance.

ΔI

V

D

L f

L

OUT

SW

=

×

(

)

1

I

I

V

V

V

V

CIN RMS

MAX

OUT

IN

OUT

IN

(

)

(

)

LOSS

DESCRIPTION

SEGMENT LOSS

Conduction Loss

Losses associated with MOSFET on-time and
on-resistance. I

RMS

is a function of load current

and duty cycle.

Gate Drive Loss

Losses associated with charging and
discharging the gate capacitance of the
MOSFET every cycle. Use the MOSFET’s (Q

G

)

specification.

Switching Loss

Losses during the drain voltage and drain
current transitions for every switching cycle.
Losses occur only during the Q

GS2

and Q

GD

time period and not during the initial Q

GS1

period. The initial Q

GS1

period is the rise in the

gate voltage from zero to V

TH.

R

DH_

is the high-

side MOSFET driver’s on-resistance and R

GATE

is the internal gate resistance of the high-side
MOSFET (Q

GD

and Q

GS2

are found in the

MOSFET data sheet).

Output Loss

Losses associated with Q

OSS

of the MOSFET

occur every cycle when the high-side MOSFET
turns on. The losses are caused by both
MOSFETs, but are dissipated in the high-side
MOSFET.

Table 1. High-Side MOSFET Losses

P

I

R

where I

V

V

CONDUCTION

RMS

DS ON

RMS

OUT

IN

=

Ч

Ч

2

(

)

II

LOAD

P

V

Q

Q

f

GATEDRIVE

DD

G

GD

SW

=

Ч

(

)

Ч

P

V

I

SWITCH

IN

LOA

=

×

D

D

SW

GS

GD

GATE

f

Q

Q

I

Ч

Ч

+

(

)

2

GATE

DD

DH

where I

V

R

=

× (

_

2

++ R

GATE

)

=

+

Ч

Ч

P

Q

Q

V

f

OUTPUT

OSS HS

OSS LS

IN

SW

(

)

(

)

2

Configurable, Single-/Dual-Output, Synchronous

Buck Controller for High-Current Applications

______________________________________________________________________________________

19

Advertising