Package information, Chip information – Rainbow Electronics MAX17409 User Manual
Page 31
Advertising
MAX17409
1-Phase Quick-PWM GPU Controller
______________________________________________________________________________________
31
Package Information
For the latest package outline information and land patterns, go
to
www.maxim-ic.com/packages
.
PACKAGE TYPE
PACKAGE CODE
DOCUMENT NO.
28 TQFN
T2844-1
Chip Information
PROCESS: BiCMOS
KELVIN SENSE VIAS UNDER
THE INDUCTOR
(SEE MAX17409 EVALUATION KIT)
KELVIN SENSE VIAS TO
INDUCTOR PAD
POWER GROUND
POWER STAGE LAYOUT (TOP SIDE OF PCB)
INDUCTOR DCR SENSING
INDUCTOR L
CSP
CSN
R
NTC
R2
R1
C
EQ
C
OUT
C
OUT
C
IN1
INPUT
SMPS
OUTPUT
Figure 8. PCB Layout Example
Advertising