Electrical characteristics, Absolute maximum ratings – Rainbow Electronics MAX15054 User Manual
Page 2
High-Side MOSFET Driver for HB LED Drivers
and DC-DC Applications
MAX15054
2 ______________________________________________________________________________________
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
V
DD
to GND ............................................................. -0.3V to +6V
LX to GND ................................................................ -2V to +65V
HDRV to LX ................................................-0.3V to (V
DD
+ 0.3V)
BST to LX ................................................................. -0.3V to +6V
HI to GND .............................................................. -0.3V to +15V
dV/dt at LX ........................................................................ 50V/ns
Peak Current into HDRV (< 100ns) ...................................... Q2A
Continuous Current into HDRV ..................................... Q100mA
Continuous Power Dissipation (T
A
= +70NC)
6-Pin SOT23 (derate 8.7mW/NC above +70NC) .........695.7mW
Thermal Resistance (Note 1)
Junction-to-Ambient Thermal Resistance (B
JA
) .........115NC/W
Junction-to-Case Thermal Resistance (B
JC
) ................80NC/W
Operating Temperature Range ........................ -40NC to +125NC
Maximum Junction Temperature .....................................+150NC
Storage Temperature Range ............................ -65NC to +150NC
Lead Temperature (soldering, 10s) .................................+300NC
ELECTRICAL CHARACTERISTICS
(V
DD
= V
BST
= 5V, V
LX
= V
GND
= 0V, T
A
= T
J
= -40°C to +125°C, unless otherwise noted. Typical values are at T
A
= T
J
= +25°C,
unless otherwise noted.) (Note 2)
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to
www.maxim-ic.com/thermal-tutorial.
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Operating Supply Voltage
V
DD
4.6
5.5
V
V
DD
Quiescent Supply Current
I
DD
No switching
40
75
F
A
BST Quiescent Supply Current
I
BST
No switching
65
125
F
A
BST Operating Supply Current
I
BSTO
f
SW
= 500kHz, no load
0.3
1.3
mA
V
DD
Undervoltage Lockout
Threshold
V
DD_UVLO
V
DD
rising
3.92
4.22
4.56
V
V
DD
Undervoltage Lockout
Threshold Hysteresis
0.2
V
BST-to-LX Undervoltage
Lockout Threshold
V
BST_
UVLO
BST rising
3.54
3.82
4.1
V
BST-to-LX Undervoltage
Lockout Threshold Hysteresis
0.2
V
LOGIC INPUT (HI)
HI Logic-High Threshold
V
IH
3.9
V
HI Logic-Low Threshold
V
IL
1.8
V
HI Logic-Input Hysteresis
0.9
V
HI Input Current
I
IN
HI = GND
-2
+2
F
A
HI Input Resistance
R
IN
300
kI
DRIVER
LX Withstand Voltage
V
LX_MAX
60
V
BST Withstand Voltage
V
BST_MAX
65
V
LX Pulldown Current
V
LX
= 2.5V
500
740
1100
F
A
Driver Output Resistance
(Sourcing)
R
ON_HP
V
BST
- V
LX
= 4.5V,
100mA sourcing
T
A
= +25NC
1
1.5
I
T
A
= +125NC
1.25
2
Driver Output Resistance
(Sinking)
R
ON_HN
V
BST
- V
LX
= 4.5V,
100mA sinking
T
A
= +25NC
0.75
1
I
T
A
= +125NC
1
1.5