Rainbow Electronics GE863-PY - Manual (Page 73)

GE863 Hardware User Guide
1vv0300783 Rev.0 - 10/06/08
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 73 of 80
Recommendations for PCB pad surfaces:
Finish Layer thickness [µm] Properties
Electro-less Ni /
Immersion Au 3 –7 /
0.05 – 0.15 Good solder ability protection, high
shear force values
The PCB must be able to resist the higher temperatures, which are occurring at the lead-free process.
This issue should be discussed with the PCB-supplier. Generally, the wet-ability of tin-lead solder
paste on the described surface plating is better compared to lead-free solder paste.
12.1.5 Solder paste
Lead free
Solder paste Sn/Ag/Cu
12.1.6 GE863 Solder Reflow
The following is the recommended solder reflow profile