Rainbow Electronics DS1386 - Manual (Page 18)

DS1386/1386P
18 of 20
DS1386P
PKG INCHES
DIM MIN NOM MAX
A 0.920 0.925 0.930
B 0.980 0.985 0.990
C - - 0.080
D 0.052 0.055 0.058
E 0.048 0.050 0.052
F 0.015 0.020 0.025
G 0.025 0.027 0.030
NOTE:
For the PowerCap Version:
a.
Dallas Semiconductor recommends that PowerCap module bases experience one pass though
solder reflow oriented with the label side up (“live-bug”).
b. Hand soldering and touch-up: do not touch or apply the soldering iron to leads for more than
3 seconds. To solder, apply flux to the pad, heat the lead frame pad and apply solder. To remove
the part, apply flux, heat the lead frame pad until the solder reflows and use a solder wick to
remove solder.