Rainbow Electronics DS1386 User Manual
Page 18
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DS1386/1386P
18 of 20
DS1386P
PKG
INCHES
DIM
MIN
NOM
MAX
A
0.920
0.925
0.930
B
0.980
0.985
0.990
C
-
-
0.080
D
0.052
0.055
0.058
E
0.048
0.050
0.052
F
0.015
0.020
0.025
G
0.025
0.027
0.030
NOTE:
For the PowerCap Version:
a.
Dallas Semiconductor recommends that PowerCap module bases experience one pass though
solder reflow oriented with the label side up (“live-bug”).
b.
Hand soldering and touch-up: do not touch or apply the soldering iron to leads for more than
3 seconds. To solder, apply flux to the pad, heat the lead frame pad and apply solder. To remove
the part, apply flux, heat the lead frame pad until the solder reflows and use a solder wick to
remove solder.
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