Teccor, Brand thyristors – Littelfuse Q6008LH1LED Series User Manual

Page 5

Advertising
background image

5

Revised: January 25, 2013 08:34 AM

©2013 Littelfuse, Inc

Specifications are subject to change without notice.

Please refer to http://www.littelfuse.com for current information.

Teccor

®

brand Thyristors

8 Amp Alternistor (High Commutation) Triac for LED dimmer application

Q6008LH1LED Series

Physical Specifications

Environmental Specifications

Test

Specifications and Conditions

AC Blocking (V

DRM

)

MIL-STD-750, M-1040, Cond A Applied
Peak AC voltage @ 110°C for 1008 hours

Temperature Cycling

MIL-STD-750, M-1051,
100 cycles; -40°C to +150°C; 15-min
dwell-time

Temperature/
Humidity

EIA / JEDEC, JESD22-A101
1008 hours; 320V - DC: 85°C; 85%
rel humidity

High Temp Storage

MIL-STD-750, M-1031,
1008 hours; 150°C

Low-Temp Storage

1008 hours; -40°C

Thermal Shock

MIL-STD-750, M-1056
10 cycles; 0°C to 100°C; 5-min dwell-
time at each temperature; 10 sec (max)
transfer time between temperature

Autoclave

EIA / JEDEC, JESD22-A102
168 hours (121°C at 2 ATMs) and
100% R/H

Resistance to
Solder Heat

MIL-STD-750 Method 2031

Solderability

ANSI/J-STD-002, category 3, Test A

Lead Bend

MIL-STD-750, M-2036 Cond E

Terminal Finish

100% Matte Tin-plated

Body Material

UL recognized epoxy meeting flammability
classification 94V-0

Terminal Material

Copper Alloy

Design Considerations

Careful selection of the correct device for the application’s
operating parameters and environment will go a long way
toward extending the operating life of the Thyristor. Good
design practice should limit the maximum continuous
current through the main terminals to 75% of the device
rating. Other ways to ensure long life for a power discrete
semiconductor are proper heat sinking and selection of
voltage ratings for worst case conditions. Overheating,
overvoltage (including dv/dt), and surge currents are
the main killers of semiconductors. Correct mounting,
soldering, and forming of the leads also help protect
against component damage.

Soldering Parameters

Reflow Condition

Pb – Free assembly

Pre Heat

- Temperature Min (T

s(min)

)

150°C

- Temperature Max (T

s(max)

)

200°C

- Time (min to max) (t

s

)

60 – 180 secs

Average ramp up rate (Liquidus Temp)
(T

L

) to peak

5°C/second max

T

S(max)

to T

L

- Ramp-up Rate

5°C/second max

Reflow

- Temperature (T

L

) (Liquidus)

217°C

- Temperature (t

L

)

60 – 150 seconds

Peak Temperature (T

P

)

260

+0/-5

°C

Time within 5°C of actual peak
Temperature (t

p

)

20 – 40 seconds

Ramp-down Rate

5°C/second max

Time 25°C to peak Temperature (T

P

)

8 minutes Max.

Do not exceed

280°C

Time

Temperature

T

P

T

L

T

S(max)

T

S(min)

25

t

P

t

L

t

S

time to peak temperature

Preheat

Preheat

Ramp-up

Ramp-up

Ramp-down

Ramp-do

Advertising