Littelfuse SP1007 Series - Manual (Page 4)

© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/22/13
TVS Diode Arrays
(SPA ® Diodes)
General Purpose ESD Protection - SP1007 Series
Package Dimensions — 0201 Flip Chip
Symbol
0201 Flipchip
Millimeters Inches
Min Typ Max Min Typ Max
A 0.595 0.620 0.645 0.0234 0.0244 0.0254
B 0.295 0.320 0.345 0.0116 0.0126 0.0136
C 0.245 0.275 0.305 0.0096 0.0108 0.0120
D 0.145 0.150 0.155 0.0057 0.0059 0.0061
E 0.245 0.250 0.255 0.0096 0.0098 0.0100
F 0.245 0.250 0.255 0.0096 0.0098 0.0100
G 0.005 0.010 0.015 0.0002 0.0004 0.0006
A
B
D
E
D
F
C
G
Recommended Soldering Pad Layout
Package Dimensions — SOD882
Part Numbering System
Part Marking System
SP 1007 01 x T G
Series
Number of
Channels Package
W: 0201 Flipchip
T= Tape & Reel
G= Green
–
TVS Diode Arrays
(SPA ® Diodes)
E: SOD882
Ordering Information
Part Number Package Marking Min. Order Qty.
SP1007-01WTG 0201 Flipchip • • 10,000
SP1007-01ETG SOD882 •b 10,000
SP1007-01WTG
b
SP1007-01ETG
Symbol
Package SOD882
JEDEC MO-236
Millimeters Inches
Min Typ Max Min Typ Max
A 0.90 1.00 1.10 0.035 0.039 0.043
B 0.50 0.60 0.70 0.020 0.024 0.028
C 0.40 0.50 0.60 0.016 0.020 0.024
D 0.45 0.018
E 0.20 0.25 0.35 0.008 0.010 0.012
F 0.45 0.50 0.55 0.018 0.020 0.022