Littelfuse Qxx25xx Series - Manual (Page 6)

136
Revised: 09/23/13
©2013 Littelfuse, Inc
Specifications are subject to change without notice.
Teccor ® brand Thyristors
25 Amp Standard & Alternistor (High Commutation) Triacs
Qxx25xx & Qxx25xHx Series
Soldering Parameters
Reflow Condition 1C
o
'SFF
BTTFNCMZ
Pre Heat
- Temperature Min (T
s(min)
) 150°C
- Temperature Max (T
s(max)
) 200°C
- Time (min to max) (t
s
) 
o

TFDT
Average ramp up rate (Liquidus Temp)
(T
L
) to peak
5°C/second max
T
S(max)
to T
L
- Ramp-up Rate 5°C/second max
Reflow
- Temperature (T
L
) (Liquidus) 217°C
- Temperature (t
L
) 
o

TFDPOET
Peak Temperature (T
P
) 260 +0/-5 °C
Time within 5°C of actual peak
Temperature (t
p
)

o

TFDPOET
Ramp-down Rate 5°C/second max
Time 25°C to peak Temperature (T
P
) 8 minutes Max.
Do not exceed 280°C
Physical Specifications Environmental Specifications
Test Specifications and Conditions
High Temperature
Voltage Blocking MIL-STD-750: Method 1040, Condition A
Rated V
RRM
, 125°C, 1008 hours
Temperature Cycling
MIL-STD-750: Method 1051
-40°C to 125°C, 15-minute dwell,
100 cycles
Biased Temp &
Humidity EIA/JEDEC: JESD22-A101
320VDC, 85°C, 85%RH, 1008 hours
High Temp. Storage
MIL-STD-750: Method 1031
150°C, 1008 hours
Low-Temp Storage -40°C, 1008 hours
Thermal Shock
MIL-STD-750: Method 1056
0°C to 100°C, 5-minute dwell,
10-second transfer, 10 cycles
Autoclave
(Pressure Cooker Test) EIA/JEDEC: JESD22-A102
121°C, 100%RH, 2atm, 168 hours
Resistance to
Solder Heat MIL-STD-750: Method 2031
260°C, 10 seconds
Solderability ANSI/J-STD-002, Category 3, Test A
Lead Bend MIL-STD-750: Method 2036, Condition E
Terminal Finish 100% Matte Tin-plated
Body Material
UL recognized epoxy meeting flammability
classification 94V-0
Lead Material Copper Alloy
Design Considerations
Careful selection of the correct device for the application’s
operating parameters and environment will go a long way
toward extending the operating life of the Thyristor. Good
design practice should limit the maximum continuous
current through the main terminals to 75% of the device
rating. Other ways to ensure long life for a power discrete
semiconductor are proper heat sinking and selection of
voltage ratings for worst case conditions. Overheating,
overvoltage (including dv/dt), and surge currents are
the main killers of semiconductors. Correct mounting,
soldering, and forming of the leads also help protect
against component damage.
Time
T
emperature
T
P
T
L
T
S(max)
T
S(min)
25
t
P
t
L
t
S
time to peak temperature
Preheat Preheat
Ramp-up Ramp-up
Ramp-down Ramp-do