SENA Parani-BCD100 - Manual (Page 3)

PARANI-BCD100
Page 3 of 22
Contents
1. General .......................................................................................................................................................... 4
1.1 Features ............................................................................................................................................... 4
1.2 Applications .......................................................................................................................................... 4
1.3 Device Diagram .................................................................................................................................... 5
1.4 Pin Diagram .......................................................................................................................................... 5
1.5 Pin Descriptions.................................................................................................................................... 6
1.6 Dimensions and PCB land pattern ....................................................................................................... 7
2. Electrical characteristics ................................................................................................................................ 8
2.1 Absolute maximum ratings ................................................................................................................... 8
2.2 Recommended operating conditions .................................................................................................... 8
2.3 Power Consumptions ........................................................................................................................... 8
3. RF Characteristics ......................................................................................................................................... 9
3.1 Basic Data Rate .................................................................................................................................... 9
3.1.1 Transmitter Performance ............................................................................................................ 9
3.1.2 Transceiver ................................................................................................................................. 9
3.1.3 Receiver Performance ............................................................................................................... 9
3.2 Enhanced Data Rate .......................................................................................................................... 10
3.2.1 Transmitter performance .......................................................................................................... 10
3.2.2 Receiver performance ............................................................................................................... 11
4. Device Terminal Descriptions ...................................................................................................................... 12
4.1 UART Interface ................................................................................................................................... 12
4.2 USB Interface ..................................................................................................................................... 12
4.3 I2C Interface ....................................................................................................................................... 13
4.4 PCM CODEC Interface ...................................................................................................................... 13
4.5 I/O Parallel Ports ................................................................................................................................ 14
4.6 Reset Interface ................................................................................................................................... 14
5. Application Schematic.................................................................................................................................. 15
6. Software Stack ............................................................................................................................................. 18
7. Solder Profiles ............................................................................................................................................. 19
8. Packaging Information ................................................................................................................................. 20
9. Certificate Information ................................................................................................................................. 22
9.1 Bluetooth SIG Certification ................................................................................................................. 22