BeStar SMS1515-08H04 LF - Manual (Page 5)

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BESTAR ELECTRONICS INDUSTRY CO.,LTD
B
Drawn Date
6 5
A A
REV.
C
D
B
Page:4 of 7
周庆阳 Drawn by:
www.be-star.com [email protected]
Note
4 3
Checked by:
Approved by:
王善梅
郭 敏
2 1
Date: 06/01/03
A
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D
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6 5
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4 3 2 1
H
Speaker
DRG NO：
周庆阳
SMS1515-08H04 LF
BS/TES01.529A
SMS1515-08H04 LF
06/01/03
4.Reflow condition
4.1 reflow solding
4.2 Recommended Land Pattern Dimensions
6.25
16.5
4-2
4
-2
.7 5
.85
12
.7
15
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15 Production Dimension
4 - *1
*2
Note
1) Land pattern*1
2) Avoid any pattern
on the shade area
*2 of PC board is highly recommended
Unit:mm
Preheating: 215
℃ for 120-150 seconds
Soldering Temperature: 235
℃ for 30-40 seconds
Peak Soldering Temperature: 260
℃ max for 10 seconds
T
e
m
pe
ra
tu
re
(
C)
Time (sec)
60-80S
150
235
215
260
Peak Temp.:260 C Max
120-150S 30-40S 50S