Surface mounting condition, Transducer – BeStar SMT1212-03XH10 LF User Manual
Page 4
SMT1212-03XH10 LF
4.Surface Mounting Condition
In automated mounting of The SMD Sound Transducers on printed circuit boards,any
bending,expanding and pulling forces or shocks against the SMD Sound Transducers shall
be kept minimum to prevent them from electrical failures and mechanical damages of the
devices.
Soldering(Reflow)
(1)solderings of The SMD Sound Transducers shall conform to the soldering conditions in
the individual specifications.
(2)The SMD Sound Transducers are designed for"Reflow Solderings"
(3)In the reflow solderings,too high soldering temperatures and too large tempearture
gradient such as rapid heating or cooling may cause electrical failures and mechanical
damages of the devices.
Fig. 1 Recommended soldering Temperature-Time profile (Reflow soldering)
Follwing soldering conditions are recommend;Refer to Fig.1
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Note
Checked by:
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Drawn by:
Date:
SMT1212-03XH10 LF
Transducer
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1
徐 波
赵 峥
王
平
11/12/15
C
06/08/07
韩学慧
D
11/12/15
徐 波
06/09/11
韩学慧
E
博 士 達
Acoustics &Sensor