Communication Concepts FM-1KW Broadcast Application Note User Manual
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RF Reference Design Data
Freescale Semiconductor
MRFE6VP61K25H MRFE6VP61K25HS FM Broadcast
APPENDIX B
Mounting Tips
The MRFE6VP61K25H/HS is packaged in the industry
standard NI--1230 air cavity package which offers a stand-
ardized package for easy replacement drop in as well as
outstanding thermal performance.
This package can be assembled into a power amplifier
system using several different mounting methods. The
popular options include bolting down with screw, clamping
and reflow soldering in a cavity. Freescale recommends
solder reflow. If customer desires to clamp the device,
special care needs to be taken due to cavity style packages.
One of the key advantages to solder mounting includes a
superior source contact--to--heatsink interface that provides
for lower thermal resistance as well as better electrical
grounding, which means that high power RF devices such as
the MRFE6VP61K25H/HS parts will have a lower junction
temperature and better RF performance when compared to
all other mounting options. Lowering the junction
temperature of the device also increase the MTTF (Mean
Time to Failure), as shown in Figure 8, MTTF versus
Junction Temperature.
Refer to AN1908 Solder Reflow Attach Method for High
Power RF Devices in Air Cavity Packages. Go to
http://freescale.com/RFpower and select Documentation/
Application Notes -- AN1908 for more information on solder
reflow attach method.