Communication Concepts 2M 1KW Amateur Application Note User Manual

Page 10

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10

RF Reference Design Data

Freescale Semiconductor

MRFE6VP61K25H MRFE6VP61K25HS 2 Meter Amateur

Ruggedness

MRFE6VP61K25H is a very rugged part capable of

handling 65:1 VSWR, provided thermal limits are not
exceeded.

It was designed for high mismatch applications, such as

laser and plasma exciters, that under normal operation
exhibit high VSWR values at startup and then come back to
a more friendly impedance. In CW at high VSWR values and
simultaneously at rated power, the limiting factor is the
maximum DC power dissipation.

VSWR protection that shuts down the gate voltage within

10 ms will protect the transistor effectively.

The amplifier presented here was tested at full power with

all phase angles with 10 ms pulsed 5% duty cycle without
failure or degradation in RF performance.

Reliability

MTTF is defined as the mean time to failure of 50% of the

device within a sample size, the primary factor in device
reliability failure is due to electromigration. Once average
operating condition for the applicatin is set, MTTF can be
calculated using the R

th

found on the offical Freescale data

sheet.

Example: If desired operating output power is 1000 W, with

82% drain efficiency at 43 volts.

• I

Drain

@ 1 kW 82% eff = 28.2 A

• MRFE6VP61K25H R

th

= 0.15°C/W, case temperature =

63°C

• Dissipated power = 219 Watts

• Temperature rise (junction to case) = 219 Watts ×

0.15°C/W = 32.8°C

• T

J

= T

rise

+ T

case

= 63°C + 32.8°C = 95.8°C

Utilizing the graph below which cacluates MTTF versus

I

Drain

and T

J;

I

Drain

= 28 A, MTTF for this example was 8000

years.

230

100000

70

1000

100

1

90

110

130

150

170

MTTF

(YEAR

S)

190

210

10000

10

24 Amp

28 Amp

20 Amp

Figure 13. MTTF versus Junction Temperature

T

J

, JUNCTION TEMPERATURE (°C)

There is an MTTF (Median--Time--To--Failure) calculator

(3)

available to assist the customers in estimating the
MRFE6VP61K25H

device

reliability

in

terms

of

electromigration wear--out mechanism.

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