Communication Concepts EB63 Engineering Bulletin - Manual (Page 3)

AR
C
HIVE INF
O
RMA
TI
O
N
ARCHIVE INFORMA
TION
EB63
3 RF Application Reports
C1 = 33 pF Dipped Mica
C2 = 18 pF Dipped Mica
C3 = 10 µF 35 Vdc for AM operation,
100 µF 35 Vdc for SSB operation.
C4 = .1 µF Erie
C5 = 10 µF 35 Vdc Electrolytic
C6 = 1 µF Tantalum
C7 = .001 µF Erie Disc
C8, 9 = 330 pF Dipped Mica
R1 = 100 k Ω 1/4 W Resistor
R2, 3 = 10 k Ω 1/4 W Resistor
R4 = 33 Ω 5 W Wire Wound Resistor
R5, 6 = 10 Ω 1/2 W Resistor
R7 = 100 Ω 1/4 W Resistor
RFC1 = 9 Ferroxcube Beads on #18 AWG Wire
D1 = 1N4001
D2 = 1N4997
Q1, Q2 = 2N4401
Q3, 4 = MRF454
T1, T2 = 16:1 Transformers
C20 = 910 pF Dipped Mica
C21 = 1100 pF Dipped Mica
C10 = 24 pF Dipped Mica
C22 = 500 µF 3 Vdc Electrolytic
K1 = Potter & Brumfield
KT11A 12 Vdc Relay or Equivalent
Q2
Q1
Q4
Q3
C9
C20
C8
C7 C6 C5 C4
R4
C22 D2
13.6 Vdc
+ -
C2
R1
R2
R7
R3 C3
T1
C21
R5
R6
T2
C10
+
-
+
-
+
-
+
-
RF
in
RF
out
RFC1
D1
+ 13.6 Vdc
C1
K1
Figure 4. Schematic Diagram