MYDATA MY200SX - Manual (Page 2)

MY200-SerieS P&P SPecificatioN – MY200SX
coMPoNeNt raNge
high PreciSioN MouNthead – MidaS
component range chip (from 01005), Soic, PLcc, tSoP, QfP, Bga, flip chip, odd-shape,
surface-mount connectors, through-hole components, cSP, ccga, dPaK,
alcap, tantalum.
component Specification Min: 0.4 x 0.2 mm (0.016” x 0.008”) (01005)
Max: 56 x 56 x 15 mm (2.20” x 2.20” x 0.59”)
(1)
Max: component weight: 140 g (2)
1) customized larger component capabilty available: 76 x 66 x 15 mm (2.9” x 2.6” x 0.59”) or 151 x 26 x 15 mm (5.9” x 1.0” x 0.59”). customized tall component capability 22 mm (0.86”) available.
contact MYdata sales for detailed customization information.
2) depending on mounthead, mount tool, package, and production altitude.
high SPeed MouNthead – hYdra z8
component range chip (from 0201), So28, Sot223, SoJ20, PLcc32, MeLf, Sod, tSoP
component Specification Min: 0.6 x 0.3 mm (0.02 x 0.01”) (0201)
Max: 18.6 x 18.6 x 5.6 mm (0.73 x 0.73 x 0.22”) (PLcc44)
eLectricaL verifier (oPtioNaL)
component range resistor, capacitor, unipolar capacitor, diode (forward voltage, reverse current),
zener diode (voltage drop), transistor (current gain)
verification time on-the-fly
viSioN caPaBiLitY
1) Standard vision camera in dual vision system (dvS).
2) high resolution camera in dual vision system (dvS).
PLaceMeNt SPeed aNd accuracY
PLaceMeNt SPeed aNd accuracY – MY200SX 10/14
rated Speed (1) 24 000 cPh
iPc 9850 chip Net throughput (2,3) 20 000 cPh
iPc 9850 chip tact time (3) 0.163 s
iPc 9850 chip repeatability 3s (X, Y, theta) (3) 30 µm, 1.8° (6)
45 µm, 1.8°
iPc 9850 chip accuracy @ cpk = 1.33 (X, Y, theta) (5) 50 µm, 2.6° (6)
75 µm, 2.6°
iPc 9850 fine Pitch Net throughput (2,4) 3 200 cPh
iPc 9850 fine Pitch tact time (4) 0.958 s
iPc 9850 fine Pitch repeatability 3s (X, Y, theta) (4) 21 µm, 0.05°
iPc 9850 fine Pitch accuracy @ cpk = 1.33 (X, Y, theta) (4,5) 35 µm, 0.09°
the above specification achieved with a machine configuration including high precision mounthead (Midas),
high speed mounthead (hYdra z8), line scan vision system (LvS) and inline conveyor t3.
the iPc 9850 net throughput and accuracy numbers are obtained simultaneously, with the same machine settings.
the rated Speed value is obtained under conditions optimized for speed.
1) depending on component and application.
2) according to iPc 9850. Net throughput = (no of parts x 3600) / (board build time + board transfer time).
3) according to iPc 9850 0402c verification panel.
4) according to iPc 9850 QfP64/QfP100 verification panel.
5) according to iPc 9850 cpk 1.33 = 4s + offset.
6) Small chip settings, recommended for 0201 (0.6 x 0.3 mm) and below.
feeder caPacitY
feeder caPacitY 8 MM taPe
T3 T4 T5 T6
MY200SX-10 112 96 - -
MY200SX-14 176 160 144 128
Board haNdLiNg
1) available for MY200SX-14.
2) optional. Suitable for irregular sized and odd shaped boards.
3) recommended board train specification: 90 x 50 mm (3.5” x 2”) board size, 1.6 mm (0.06”) thickness.
4) customized tall component capability 22 mm (0.86”)
iNLiNe coNveYor
T3 T4 T5 (1) T6 (1)
Maximum Board Size 443 x 508 mm
(17.4” x 20”) 575 x 508 mm
(22.6" x 20") 736 x 609 mm
(29" x 24") 914 x 609 mm
(36" x 24")
Maximum Board Size with ML adaptor (2) 419 x 443 mm
(16.5” x 17.4”) 554 x 443 mm
(21.8" x 17.4") 725 x 556 mm
(28" x 22") 905 x 556 mm
(35.5" x 22")
Minimum Board Size (3) 70 x 50 mm
(2.7” x 2”) 70 x 50 mm
(2.7" x 2") 70 x 50 mm
(2.7" x 2") 70 x 50 mm
(2.7" x 2")
Board thickness range 0.4 - 6.0 mm
(0.016” - 0.24”) 0.4 - 6.0 mm
(0.016" - 0.24") 0.8 - 12.5 mm
(0.03" - 0.5") 0.8 - 12.5 mm
(0.03" - 0.5")
Board edge clearance top and Bottom 3.2 mm (0.13”) 3.2 mm (0.13") 3.2 mm (0.13") 3.2 mm (0.13")
top Side clearance (max) (4) 15 mm (0.59”) 15 mm (0.59") 15 mm (0.59") 15 mm (0.59")
Bottom Side clearance (max) 32 mm (1.25”) 32 mm (1.25") 32 mm (1.25") 32 mm (1.25")
Maximum Board Weight 5 kg (11 lbs) 8 kg (17 lbs) 15 kg (33 lbs) 15 kg (33 lbs)
Board transfer height conforms to SMeMa standard for board transfer height. height adjustable from 880 to
975 mm (34.6” to 38.4”).
operation Mode inline, manual, inline odd-board, left-to-right / right-to-left
SYSteM featureS
SYSteM featureS MY200SX
on-the-fly mount order optimization
vision autoteach with snap-to-grid
automatic illumination settings
intelligent feeder concept – agilis
on-the-fly feeder loading
automatic feeder and component recognition
dynamic feeder positions
automatic board stretch compensation
automatic conveyor width adjustment
intelligent surface impact control
tool collision avoidance
Multi-user, multi-tasking system software
open software interfaces for factory integration
SQL database engine
Programmable light settings fiducial camera
1) Line scan vision camera.
LiNeScaN viSioN SYSteM
componenT Type camera max acTive field of view min piTch min lead widTh
Leaded components Lvc (1) 56 x 56 mm
(2.2” x 2.2”) 0.20 mm (8 mil) 0.10 mm (4 mil)
Bumped components Lvc (1) 56 x 56 mm
(2.2” x 2.2”) 0.30 mm (12 mil) 0.15 mm (6 mil)
duaL viSioN SYSteM (oPtioNaL)
componenT Type camera max acTive field of view min piTch min lead widTh
Leaded components Svc (1) 56 x 52 mm
(2.20” x 2.04”) 0.40 mm (16 mil) 0.20 mm (8 mil)
hrc (2) 15 x 15 mm
(0.59” x 0.59”) 0.10 mm (4 mil) 0.05 mm (2 mil)
Bumped components Svc (1) 56 x 52 mm
(2.20” x 2.04”) 0.50 mm (20 mil) 0.25 mm (10 mil)
hrc (2) 15 x 15 mm
(0.59” x 0.59”) 0.16 mm (6.3 mil) 0.08 mm (3.1 mil)