HP OneView for Red Hat Enterprise Virtualization - Manual (Page 19)

Infrastructure tab
NOTE: The Infrastructure inventory and status information is displayed only for BL servers.
Infrastructure information For ML/DL servers is not displayed.
To view enclosure inventory, performance and health status data about the selected host, click the
Infrastructure tab. The Infrastructure information tables are displayed:
Enclosure Information
The Enclosure Information table contains:
•
Enclosure Name—The name of the enclosure as defined in the OA interface.
•
Product—The HP product name for the enclosure.
•
Rack Name—The name of the rack containing the enclosure.
•
Blade Bays—The total number of blade bays available in the enclosure, including empty bays.
•
Fan Bays—The total number of fan bays available in the enclosure, including empty bays.
•
Power Supply Bays—The total number of power supply bays available in the enclosure,
including empty bays.
•
Interconnect Bays—The total number of bays available in the enclosure for interconnect modules.
•
Serial Number—The HP serial number.
•
UUID—The universally unique identifier assigned when the enclosure was manufactured.
•
Part Number—The HP part number for the enclosure.
•
Spare Part Number—The HP spare part number for the enclosure.
Power Information
The Power Information data table contains:
•
Redundancy—The status of power subsystem redundancy: either in a redundant configuration,
not in a redundant configuration, or status unknown.
•
Capacity—The maximum amount of power that can be delivered by the power subsystem.
•
Redundant Capacity—The amount of redundant power available. This is the backup power
available if the subsystem power supply fails.
•
Output Power—The amount of power in Watts that the subsystem is producing.
•
Power Consumed—The current power consumed by the subsystem.
•
Good Power Supplies—The number of power supplies that are currently operating in the
subsystem.
•
Wanted Power Supplies—The needed number of power supplies plus the redundant number
of power supplies in the subsystem.
•
Needed Power Supplies—The number of power supplies needed for the subsystem to work
properly.
Thermal Information
The Thermal Information data table contains:
•
Redundancy—The status of thermal subsystem redundancy: either in a redundant configuration,
not in a redundant configuration, or status unknown.
•
Ambient Temperature—The temperature inside the enclosure.
•
Good Fans—The number of fans currently operating in the enclosure.
Infrastructure tab 19