Document Outline

• HP ProLiant ML310e Gen8 Server User Guide
• Abstract
• Notice
• Contents
• Component identification
  • Front panel components
    • Front panel LEDs and buttons
  • Rear panel components
    • Rear panel LEDs and buttons
  • System board components
    • DIMM slot locations
    • PCIe expansion slot definitions
    • System maintenance switch
    • NMI header
  • Drive numbering
  • Drive LED definitions
  • FBWC module LED definitions
  • Fan locations
  • T-10/T-15 Torx screwdriver
• Operations
  • Power up the server
  • Power down the server
  • Unlock the tower bezel
  • Remove the tower bezel
  • Install the tower bezel
  • Remove the access panel
  • Install the access panel
  • Remove the air baffle
  • Install the air baffle
• Setup
  • Optional installation services
  • Rack planning resources
  • Optimum environment
    • Space and airflow requirements
    • Temperature requirements
    • Power requirements
    • Electrical grounding requirements
  • Server warnings and cautions
  • Rack warnings
  • Identifying the contents of the server shipping carton
  • Installing hardware options
  • Installing the server into the rack
  • Installing the operating system
  • Powering on and selecting boot options
  • Registering the server
• Hardware options installation
  • Introduction
  • Drive options
    • Drive installation guidelines
    • Installing a non-hot-plug drive
    • Installing a hot-plug drive
  • Drive cage options
    • Four-bay LFF hot-plug drive backplane option
    • Eight-bay SFF hot-plug drive cage option
  • Controller options
    • Installing a storage controller
    • Installing the FBWC module and capacitor pack
  • Optical drive option
  • Memory options
    • HP SmartMemory
    • DIMM identification
    • Single-rank and dual-rank DIMMs
    • Memory subsystem architecture
    • ECC memory
    • General DIMM slot population guidelines
    • Installing a DIMM
  • Expansion board options
  • Dedicated iLO management port option
    • Enabling the dedicated iLO management port
  • HP Trusted Platform Module option
    • Installing the Trusted Platform Module board
    • Retaining the recovery key/password
    • Enabling the Trusted Platform Module
  • RPS enablement option
• Cabling
  • Cabling overview
  • Storage cabling
    • Four-bay LFF drive cabling
      • Non-hot-plug, SATA drive support only
      • Non-hot-plug, SATA and SAS drive support
      • Hot-plug, SATA drive support
      • Hot-plug, SATA and SAS drive support
    • Eight-bay SFF drive cabling
  • Media drive cabling
  • Power supply cabling
    • Nonredundant power supply cabling
    • Redundant power supply cabling
  • Capacitor pack cabling
• Software and configuration utilities
  • Server mode
  • Server QuickSpecs
  • HP iLO Management Engine
    • HP iLO
      • Active Health System
      • Integrated Management Log
    • Intelligent Provisioning
      • HP Insight Diagnostics
        • HP Insight Diagnostics survey functionality
      • Erase Utility
    • HP Insight Remote Support software
    • Scripting Toolkit
  • HP Service Pack for ProLiant
    • HP Smart Update Manager
  • HP ROM-Based Setup Utility
    • Using RBSU
    • Auto-configuration process
    • Boot options
    • Re-entering the server serial number and product ID
  • Utilities and features
    • Array Configuration Utility
    • Option ROM Configuration for Arrays
    • ROMPaq utility
    • Automatic Server Recovery
    • USB support
    • Redundant ROM support
      • Safety and security benefits
  • Keeping the system current
    • Drivers
    • Software and firmware
    • Version control
    • HP Operating Systems and Virtualization Software Support for ProLiant Servers
    • Change control and proactive notification
• Troubleshooting
  • Troubleshooting resources
• System battery replacement
• Regulatory compliance notices
  • Regulatory compliance identification numbers
  • Federal Communications Commission notice
    • FCC rating label
    • FCC Notice, Class A Equipment
    • FCC Notice, Class B Equipment
  • Declaration of conformity for products marked with the FCC logo, United States only
  • Modifications
  • Cables
  • Canadian notice (Avis Canadien)
  • European Union regulatory notice
  • Disposal of waste equipment by users in private households in the European Union
  • Japanese notice
  • BSMI notice
  • Korean notice
  • Chinese notice
  • Vietnam compliance marking notice
  • Ukraine notice
  • Laser compliance
  • Battery replacement notice
  • Taiwan battery recycling notice
  • Power cord statement for Japan
  • Acoustics statement for Germany (Geräuschemission)
• Electrostatic discharge
  • Preventing electrostatic discharge
  • Grounding methods to prevent electrostatic discharge
• Specifications
  • Environmental specifications
  • Server specifications
  • Power supply specifications
    • HP 350 W 4U Factory Integrated Power Supply
    • HP 460 W CS Gold Hot-plug Power Supply (92% efficiency)
    • Hot-plug power supply calculations
• Support and other resources
  • Before you contact HP
  • HP contact information
  • Customer Self Repair
• Acronyms and abbreviations
• Documentation feedback
• Index