Document Outline

• HP ProLiant SL270s Gen8 Server User Guide
• Abstract
• Notice
• Contents
• Component identification
  • Front panel components
  • Front panel LEDs and buttons
  • Rear panel components
  • Rear panel LEDs and buttons
  • System board components
    • DIMM slot locations
    • System maintenance switch
    • NMI jumper
  • Device numbers
  • GPU numbering
  • Drive LED definitions
• Operations
  • Power up the server
  • Power down the server
  • Remove the server from the chassis
  • Remove the processor air baffle
• Setup
  • Optional installation services
  • Rack planning resources
  • Optimum environment
    • Space and airflow requirements
    • Temperature requirements
    • Power requirements
    • Electrical grounding requirements
  • Rack warnings
  • Contents of the server shipping carton
  • Installing the chassis
  • Installing options
  • Installing components
  • Installing the server into the chassis
  • Powering up the chassis
  • Configuring the chassis
  • Powering on and selecting boot options
  • Installing the system software
  • Registering the server
• Hardware options installation
  • Introduction
  • Processor option
  • Memory options
    • HP SmartMemory
    • Memory subsystem architecture
    • Single-, dual-, and quad-rank DIMMs
    • DIMM identification
    • Memory configurations
      • Maximum memory configurations
      • Advanced ECC memory configuration
      • Online Spare memory configuration
      • Lockstep memory configuration
    • General DIMM slot population guidelines
      • Advanced ECC population guidelines
      • Online spare population
      • Lockstep Memory population guidelines
      • Population order
    • Installing a DIMM
  • Hot-plug hard drive guidelines
    • Removing the hard drive blank
    • Installing a hot-plug SAS hard drive
  • Controller options
    • Installing the cache module
    • Installing the FBWC capacitor pack
  • Expansion board options
    • Installing an expansion board or FlexibleLOM
    • Installing a PCI riser board assembly
  • Redundant hot-plug power supply option
  • Installing the 8X SFF Smart Array enablement option
  • Connecting the SUV cable
  • HP Trusted Platform Module option
    • Installing the Trusted Platform Module board
    • Retaining the recovery key/password
    • Enabling the Trusted Platform Module
• Cabling
  • Cabling overview
  • FBWC capacitor pack cabling
• Software and configuration utilities
  • Server mode
  • Server QuickSpecs
  • HP iLO Management Engine
    • HP iLO
      • Active Health System
      • Integrated Management Log
    • Intelligent Provisioning
      • HP Insight Diagnostics
        • HP Insight Diagnostics survey functionality
      • Erase Utility
    • HP Insight Remote Support software
    • Scripting Toolkit
  • HP Service Pack for ProLiant
    • HP Smart Update Manager
  • HP ROM-Based Setup Utility
    • Using RBSU
    • Auto-configuration process
    • Boot options
    • Configuring AMP modes
    • Re-entering the server serial number and product ID
  • Utilities and features
    • Array Configuration Utility
    • Option ROM Configuration for Arrays
    • ROMPaq utility
    • Automatic Server Recovery
    • USB support
    • Redundant ROM support
      • Safety and security benefits
  • Keeping the system current
    • Drivers
    • Software and firmware
    • Version control
    • HP Operating Systems and Virtualization Software Support for ProLiant Servers
    • HP Technology Service Portfolio
    • Change control and proactive notification
• Troubleshooting
  • Troubleshooting resources
• System battery
• Regulatory compliance notices
  • Regulatory compliance identification numbers
  • Federal Communications Commission notice
    • FCC rating label
    • FCC Notice, Class A Equipment
    • FCC Notice, Class B Equipment
  • Declaration of conformity for products marked with the FCC logo, United States only
  • Modifications
  • Cables
  • Canadian notice (Avis Canadien)
  • European Union regulatory notice
  • Disposal of waste equipment by users in private households in the European Union
  • Japanese notice
  • BSMI notice
  • Korean notice
  • Chinese notice
  • Vietnam compliance marking notice
  • Ukraine notice
  • Laser compliance
  • Battery replacement notice
  • Taiwan battery recycling notice
  • Power cord statement for Japan
  • Acoustics statement for Germany (Geräuschemission)
• Electrostatic discharge
  • Preventing electrostatic discharge
  • Grounding methods to prevent electrostatic discharge
• Specifications
  • Environmental specifications
  • Server specifications
  • Hot-plug power supply calculations
• Support and other resources
  • Before you contact HP
  • HP contact information
  • Customer Self Repair
• Acronyms and abbreviations
• Documentation feedback
• Index