Asus Motherboard P7P55-M - Manual (Page 27)

ASUS P7P55-M 1-17
Vendor Part No. Size
SS/
DS
Brand Chip NO.
Timing
DIMM
(BIOS)
Voltage
DIMM
Support
A* B* C*
Crucial BL25664ABA1336.16SFB1 4096MB(Kit of 2) DS N/A Heat-Sink Package 6-6-6-20 1.8V • •
Crucial BL25664BA1336.16SFB1 4096MB(Kit of 2) DS N/A Heat-Sink Package 6-6-6-20 1.8V • • •
Crucial BL25664BN1337.16FF
(XMP)
6144MB(Kit of 3 ) DS N/A Heat-Sink Package 7-7-7-24 1.65V • • •
Crucial CT25664BA1339.16SFD 6144MB(Kit of 3 ) DS Micron 8UD22D9JNM 9 • •
G.SKILL F3-10600CL8D-2GBHK 1024MB SS G.SKILL Heat-Sink Package • • •
G.SKILL F3-10600CL9D-2GBPK 1024MB SS G.SKILL Heat-Sink Package • • •
G.SKILL F3-10666CL7T-3GBPK 3072MB(Kit of 3) SS N/A Heat-Sink Package 7-7-7-18 1.5~1.6V • •
G.SKILL F3-10666CL9T-3GBNQ 3072MB(Kit of 3) SS N/A Heat-Sink Package 9-9-9-24 1.5~1.6V • • •
G.SKILL F3-10600CL7D-2GBPI 1024MB DS G.SKILL Heat-Sink Package • • •
G.SKILL F3-10600CL9D-2GBNQ 1024MB DS G.SKILL Heat-Sink Package • • •
G.SkiLL F3-10666CL8D-4GBHK 4096MB(Kit of 2 ) DS N/A Heat-Sink Package 8-8-8-21 1.5-1.6V • • •
G.SKILL F3-10666CL7T-6GBPK 6144MB(Kit of 3 ) DS N/A Heat-Sink Package 7-7-7-18 1.5~1.6V • • •
G.SKILL F3-10666CL9T-6GBNQ 6144MB(Kit of 3) DS N/A Heat-Sink Package 9-9-9-24 1.5V~1.6V • • •
GEIL DDR3-1333 CL9-9-9-24 1024MB SS N/A Heat-Sink Package 9 • • •
GEIL GV34GB1333C7DC 2048MB DS N/A Heat-Sink Package 7-7-7-24 1.5V • • •
GEIL GG34GB1333C9DC 4096MB(Kit of 2) DS GEIL GL1L128M88BA12N 9-9-9-24 1.3V(low
voltage)
• • •
GEIL DDR3-1333 CL9-9-9-24 6144MB(Kit of 3 ) DS N/A Heat-Sink Package 9 1.5V • • •
Kingmax FLFD45F-B8MF9 1024MB SS Micron 8HD22D9JNM • •
Kingmax FLFD45F-B8MH9 MAES 1024MB SS Micron 9CF22D9KPT • • •
Kingmax FLFE85F-B8MF9 2048MB DS Micron 8HD22D9JNM • •
Kingmax FLFE85F-B8MH9 MEES 2048MB DS Micron 9GF27D9KPT • • •
Kingston KVR1333D3N9/1G 1024MB SS Hynix H5TQ1G83BFR 9 1.5V • • •
Kingston KVR1333D3N9/2G 2048MB DS Qimonda IDSH1G-03A1F1C-13H 1.5V • • •
Micron MT8JTF12864AY-1G4D1 1024MB SS Micron 8LD22D9JNM • • •
Micron MT8JTF12864AZ-1G4F1 1024MB SS Micron 9FF22D9KPT 9 • • •
Micron MT9JSF 12872AZ-1G4F1 1024MB SS Micron 91F22D9KPT(ECC) 9 • • •
Micron MT8JTF12864AY-1G4D1 3072MB(Kit of 3) SS Micron 8XD22D9JNM 9 • • •
Micron MT12JSF25672AZ-1G4F1 2048MB DS Micron 91F22D9KPT(ECC) 9 • • •
Micron MT16JTF25664AY-1G1D1 2048MB DS Micron 8LD22 D9JNM • •
Micron MT18JTF25664AZ-1G4F1 2048MB DS Micron 9KF27D9KPT 9 • • •
Micron MT16JTF25664AY-1G4D1 6144MB(Kit of 3) DS Micron 8UD22D9JNM 9 • •
OCZ OCZ3P13332GK 2048MB(Kit of 2) SS N/A Heat-Sink Package 7-7-7-20 1.8V • •
OCZ OCZ3X1333LV3GK(XMP) 3072MB(Kit of 3) SS N/A Heat-Sink Package 1.6V • •
OCZ OCZ3G13334GK 4096MB(Kit of 2) DS N/A Heat-Sink Package 1.7V • • •
OCZ OCZ3RPX1333EB4GK 4096MB(Kit of 2) DS N/A Heat-Sink Package 6-5-5-20 1.85V • • •
OCZ OCZ3X13334GK(XMP) 4096MB(Kit of 2) DS N/A Heat-Sink Package 1.75V • • •
OCZ OCZ3G1333LV6GK 6144MB(Kit of 3 ) DS N/A Heat-Sink Package 9-9-9-20 1.65V • • •
OCZ OCZ3P1333LV6GK 6144MB(Kit of 3 ) DS N/A Heat-Sink Package 7-7-7-20 1.65V • • •
OCZ OCZ3X1333LV6GK(XMP) 6144MB(Kit of 3 ) DS N/A Heat-Sink Package 8-8-8-20 1.60V • • •
SAMSUNG M378B2873DZ1-CH9 1024MB SS Samsung K4B1G0846D-HCH9 • • •
SAMSUNG M378B2873DZ1-CH9 1024MB SS Samsung SEC 846 HCH9 K4B1G08460 • • •
SAMSUNG M378B2873EH1-CH9 1024MB SS Samsung SEC 913 HCH9 K4B1G0846E • • •
SAMSUNG M391B2873DZ1-CH9 1024MB SS Samsung K4B1G0846D-HCH9(ECC) • • •
SAMSUNG M378B5673DZ1-CH9 2048MB DS Samsung K4B1G0846D-HCH9 • • •
SAMSUNG M378B5673EH1-CH9 2048MB DS Samsung SEC 913 HCH9 K4B1G0846E • • •
(continued on the next page)
DDR3 1333 MHz capability