HMC Electronics 41450 Loctite 414 SuperBonder, Instant Adhesive, Plastic Bonder User Manual
Loctite
Technical Data Sheet
LOCTITE
®
414
November
-
2010
PRODUCT DESCRIPTION
LOCTITE
®
414 provides the following product characteristics:
Technology
Cyanoacrylate
Chemical Type
Ethyl cyanoacrylate
Appearance (uncured)
Transparent,
colorless
to
straw
colored liquid
LMS
Components
One part - requires no mixing
Viscosity
Low
Cure
Humidity
Application
Bonding
Key Substrates
Plastics, Rubbers and Metals
LOCTITE
®
414 is a general purpose cyanoacrylate instant
adhesive.
Commercial Item Description A-A-3097:
LOCTITE
®
414 has been qualified to Commercial Item
Description A-A-3097. Note: This is a regional approval.
Please contact your local Technical Service Center for more
information and clarification.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C
1.05
Viscosity, Cone & Plate, mPa·s (cP):
Temperature: 25 °C, Shear Rate: 3,000 s
-1
70 to 110
LMS
Viscosity, Brookfield - LVF, 25 °C, mPa·s (cP):
Spindle 1, speed 30 rpm
100 to 150
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Under normal conditions, the atmospheric moisture initiates the
curing process. Although full functional strength is developed
in a relatively short time, curing continues for at least 24 hours
before full chemical/solvent resistance is developed.
Cure Speed vs. Substrate
The rate of cure will depend on the substrate used. The table
below shows the fixture time achieved on different materials
at 22 °C / 50 % relative humidity. This is defined as the time to
develop a shear strength of 0.1 N/mm².
Fixture Time, seconds:
Steel (degreased)
15 to 30
Aluminum
2 to 10
Neoprene
<5
Rubber, nitrile
<5
ABS
2 to 10
PVC
2 to 10
Polycarbonate
15 to 50
Phenolic
5 to 15
Cure Speed vs. Bond Gap
The rate of cure will depend on the bondline gap. Thin bond
lines result in high cure speeds, increasing the bond gap will
decrease the rate of cure.
Cure Speed vs. Activator
Where cure speed is unacceptably long due to large gaps,
applying activator to the surface will improve cure speed.
However, this can reduce ultimate strength of the bond and
therefore testing is recommended to confirm effect.
TYPICAL PROPERTIES OF CURED MATERIAL
After 24 hours @ 22 °C
Physical Properties:
Coefficient of Thermal Expansion,
ISO 11359-2, K
-1
80×10
-6
Coefficient of Thermal Conductivity, ISO 8302,
W/(m·K)
0.1
Glass Transition Temperature, ASTM E 228, °C 120
Electrical Properties:
Dielectric Constant / Dissipation Factor, IEC 60250:
0.05
-
kHz
2.3 / <0.02
1
-
kHz
2.3 / <0.02
10
-
kHz
2.3 / <0.02
Volume Resistivity, IEC 60093, Ω·cm
10×10
15
Dielectric Breakdown Strength,
IEC 60243-1, kV/mm
25
TYPICAL PERFORMANCE OF CURED MATERIAL
Adhesive Properties
After 24 hours @ 22 °C
Lap Shear Strength, ISO 4587:
Steel
(grit blasted)
N/mm² 18 to 26
(psi) (2,610 to 3,770)
Aluminum (etched)
N/mm² 11 to 19
(psi) (1,595 to 2,755)
ABS
N/mm² >6
(psi) (>870)
PVC
N/mm² >4
(psi) (>580)
Polycarbonate
N/mm² >5
(psi) (>725)
Phenolic
N/mm² 5 to 15
(psi) (725 to 2,175)
Neoprene
N/mm² >10
(psi) (>1,450)
Nitrile
N/mm² >10
(psi) (>1,450)
Tensile Strength, ISO 6922:
Steel (grit blasted)
N/mm² 12 to 25
(psi) (1,745 to 3,625)
After 10 seconds @ 22 °C
Tensile Strength, ISO 6922:
Buna-N
N/mm² ≥6.0
LMS
(psi) (≥870)
Documentation Provided By HMC Electronics
33 Springdale Ave. Canton, MA 02021
(800) 482-4440