Pre-heating, So ld e ri n g – Mag Layers USA RT12P18 User Manual
Page 5
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Reflow Soldering
Natural
cooling
260°C
Time(s)
T
e
m
p
e
ra
tu
re
(°
C
)
●
IR Reflow soldering :
Preheat at 3
℃
per second to 217
℃
and using lead free solder ,
IR at 260
℃
for 30seconds Max.
●
Rework flow:
Component must withstand two IR reflow cycles with a cool down
between cycles
●
Temperature is measured at the terminal portion of product
(Using thermocoupler for measurement).
●
This profile is reference data we recommend. Please check in your
actual process.
●
For reliable soldering, the thickness of solder paste screen should
be over the terminal co-planality.
●
The cutted end of terminal has no plating
(out of subject of solder ability).
150°C
53sec TYP.
Pre-heating
60sec MIN.
180sec MAX.
3°C /sec MAX.
6°C /sec MAX.
S
o
ld
e
ri
n
g
200°C
217°C
60sec MIN.
150sec MAX.
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