Pre-heating, So ld e ri n g – Mag Layers USA RT14P03 User Manual

Page 5

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Reflow Soldering

Natural

cooling

245°C

Time(s)

T

e

m

p

e

ra

tu

re

(°

C

)

●

IR Reflow soldering :

Preheat at 3

℃

per second to 217

℃

and using lead free solder ,

IR at 245

℃

for 30seconds Max.

●

Rework flow:

Component must withstand two IR reflow cycles with a cool down
between cycles

●

Temperature is measured at the terminal portion of product

(Using thermocoupler for measurement).

●

This profile is reference data we recommend. Please check in your

actual process.

●

For reliable soldering, the thickness of solder paste screen should

be over the terminal co-planality.

●

The cutted end of terminal has no plating

(out of subject of solder ability).

150°C

53sec TYP.

Pre-heating

60sec MIN.

180sec MAX.

3°C /sec MAX.

6°C /sec MAX.

S

o

ld

e

ri

n

g

200°C

217°C

60sec MIN.

150sec MAX.

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