2 functional specification, Processor, Functional specification – Kontron COMe-bIP6 User Manual
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COMe-bIP6 / Product Specification
3.2
Functional Specification
Processor
The 22nm Intel® 3rd Gen Core™ i7/i5/i3/Celeron® embedded (Ivy Bridge) CPU family with 31x24mm package size
(FCBGA1023 socket) supports:
» Intel® Turbo Boost Technology 2.01
» Intel® 64
» Intel® Virtualization Technology (VT-x)
» Intel® Virtualization Technology for Directed I/O (VT-d)
» AES New Instructions (AES-NI)
» Intel® Hyper-Threading Technology
» Enhanced Intel SpeedStep® Technology
» Idle States (C-States)
» Intel® Smart Cache
» Thermal Monitoring Technologies
» Intel® Fast Memory Access
» Intel® Flex Memory Access
» Integrated Intel® HD Graphics with Dynamic Frequency
» Configurable Thermal Design Power (cTDP)
Optional available (with customized BIOS):
» Intel® vPRO™ Technology including:
» Intel® Active Management Technology (AMT)
» Intel® Trusted Execution Technology (TXT)
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