Introduction ep-6vba, S.e.c. cartridge terminology – EPoX Computer EP-6VBA User Manual

Page 9

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Introduction

EP-6VBA

Page 1-3

The entire enclosed product is called the Pentium

®

II or Pentium

®

III Processor.

The packaging technology and each of the physical elements of the product are
referred to using accurate technical descriptions. This allows clear reference to
the products as just a processor. This is the model used in past packaging tech-
nologies like PGA, TCP, PQFP, DIP, etc.

S.E.C. Cartridge Terminology

Pentium

®

II or Pentium

®

III Processor

The new enclosed card packaging technology is called a “Single Edge
Contact cartridge.” This is similar to previous names for packaging
technology such as PGA or TCP.

Processor card
The green PCB (with or without components on it)

Processor core
The silicon on the PLGA package on the PCB

Cover
The plastic cover on the opposite side from the thermal plate.

Slot 1
The slot that the S.E.C. cartridge plugs into, just as the Pentium

®

Pro

processor uses Socket 8.

Retention mechanism
Formerly ‘retention module’ the dual posts, etc. that holds the cartridge in
place.

Thermal plate
The heatsink attachment plate.

Heat sink supports
The support pieces that are mounted on the mainboard to provide added
support for heatsinks.

Figure 1:

Pentium

®

II or Pentium

®

III Processor

CPU with S.E.C. Cartridge

Processor

Printed Circuit Board

Thermal Plate

Cover

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