Epson S1C63558 - Manual (Page 181)

S1C63558 TECHNICAL MANUAL EPSON 171
CHAPTER 9: PAD LAYOUT
CHAPTER
9 P
AD
L
AYOUT
9.1 Diagram of Pad Layout
Chip thickness: 400 µm
Pad opening:
100 µm
X
Y
(0, 0)
4.01 mm
4.50 mm
1 5 10 15 20 25 30
35
40
45
50
55
60
65 70 75 80 90 85
95
100
105
110
115
120
122 Die No.