HP HDX 16 - Manual (Page 95)

Removal and replacement procedures 4–60
✎
The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink assembly, the system board,
and the processor each time the fan/heat sink assembly is removed:
■ Thermal paste is used on the processor 1 and the heat sink section 2 that services it.
■ Thermal pads are used on the Northbridge chip 3 and the heat sink section 4 that services it.
■ Thermal pads are used on various other system board components 5 and 7, and the sections of the
heat sink 6 and 8.
Replacement thermal material is included with all fan/heat sink assembly, system board, and processor spare
part kits.
Reverse this procedure to install the fan/heat sink assembly.