HP DL560 User Manual

Quickspecs, What's new, At a glance

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1. Dual 550W Hot Plug Redundant Power

2. 2U (3.5" Height) rack form factor

3. PCI-X Riser Cage, Three 64-bit PCI-X slots

4. Six memory DIMM slots

5. Tool-less "Snap in" Rail Solution

6. Hood

7. LEDs

8. Slimline Removable media Bay with 24x CD-ROM installed

9. Hood latch (accesses processors and fans)

10. 1.44 MB Diskette Drive

11. Wide Ultra3 SCSI drive cage for two hot plug hard drives
or one DAT hot plug tape drive (plus 1 hard drive)

12. Hot Plug Fans

13. DC Power Converter Module

What's New

Intel® Xeon® Processors MP at 3.0 GHz/4MB, 2.7 GHz/2MB, or 2.2 GHz/2MB (Expandable to 4 processors)

At a Glance

Intel Xeon Processors MP at 3.0 GHz/4MB, 2.7 GHz/2MB, 2.2 GHz/2MB, 2.8 GHz/2MB, 2.5 GHz/1MB, 2.0 GHz/1MB
(Expandable to 4 processors)
The HP ProLiant DL560 delivers extraordinary performance and maximum power efficiency in an ultra dense, rack
optimized form factor ServerWorks Grand Champion-LE chipset
2x1 interleaved memory, 200MHz DDR SDRAM Memory (PC2100 Registered SDRAM with Advanced ECC
functionality)
1024 MB or 512 MB (depending on model) standard memory, expandable to 12 GB
HP Advanced Memory Protection
Two, full length 64-bit/100 MHz Non-Hot Pluggable PCI slots, one full length 64-bit/133 MHz Non-Hot Pluggable
Integrated Lights-Out Standard Management (iLO) on system board
Two NC7781 PCI-X Gigabit NICs (embedded)
Integrated Smart Array 5i Plus Controller (Ultra3) with 64-MB total memory on 5i Plus Memory Module
Battery-Backed Write Cache Enabler module on all 2P models (optional on 1P model)
Internal Hot Plug Drive Storage of up to 600 GB (2 x 300 GB 1" Ultra320 hard drives)
Redundant Cooling Zones for major subsystems (Memory, I/O, CPUs) assure 7x24 cooling
Toolless and virtually cable-less internal design
Rapid Deployment racking solution (rack rails and cable management)
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QuickSpecs

HP ProLiant DL560

Overview

DA - 11595 Worldwide QuickSpecs — Version 46 — 12.16.2005

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