Intel 317443-001US - Manual (Page 10)

Intel ® 945GME Express Chipset—About This Manual
Intel ® Core TM 2 Duo processor with the Mobile Intel ® 945GME Express Chipset
Manual May 2007
10 Order Number: 317443-001US
needed to ensure the setup time of the receiver. More precisely,
flight time is defined as:
• The time difference between a signal at the input pin of a
receiving agent crossing the switching voltage (adjusted to
meet the receiver manufacturer’s conditions required for
AC timing specifications; i.e., ringback, etc.) and the output
pin of the driving agent crossing the switching voltage
when the driver is driving a test load used to specify the
driver’s AC timings.
• Maximum and Minimum Flight Time - Flight time variations
are caused by many different parameters. The more
obvious causes include variation of the board dielectric
constant, changes in load condition, crosstalk, power noise,
variation in termination resistance, and differences in I/O
buffer performance as a function of temperature, voltage,
and manufacturing process. Some less obvious causes
include effects of Simultaneous Switching Output (SSO)
and packaging effects.
• Maximum flight time is the largest acceptable flight time a
network will experience under all conditions.
• Minimum flight time is the smallest acceptable flight time a
network will experience under all conditions.
Infrared Data Assoc. The Infrared Data Association (IrDA) has outlined a specification
for serial communication between two devices via a bi-
directional infrared data port. The 945GME platform has such a
port and it is located on the rear of the platform between the two
USB connectors.
IMVP6 The Intel Mobile Voltage Positioning specification for the Intel ®
Core™ 2 Duo Processor. It is a DC-DC converter module that
supplies the required voltage and current to a single processor.
Inter-Symbol Interference
Inter-symbol interference is the effect of a previous signal (or
transition) on the interconnect delay. For example, when a
signal is transmitted down a line and the reflections due to the
transition have not completely dissipated, the following data
transition launched onto the bus is affected. ISI is dependent
upon frequency, time delay of the line, and the reflection
coefficient at the driver and receiver. ISI may impact both timing
and signal integrity.
Media Expansion Card
The Media Expansion Card (MEC) provides digital display options
through the SDVO interface. The MEC card also incorporates
video-in.
Network The network is the trace of a Printed Circuit Board (PCB) that
completes an electrical connection between two or more
components.
Overshoot The maximum voltage observed for a signal at the device pad,
measured with respect to VCC.
Pad The electrical contact point of a semiconductor die to the
package substrate. A pad is only observable in simulations.
Pin The contact point of a component package to the traces on a
substrate, such as the motherboard. Signal quality and timings
may be measured at the pin.