3 system i/o and connector summary, 11 clocks, 12 real time clock – Intel 317443-001US User Manual

Page 27: 13 thermal monitoring, System i/o and connector summary, I/o connectors are described in, Section 3.4.3

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Intel

®

Core

TM

2 Duo processor with the Mobile Intel

®

945GME Express Chipset

May 2007

Manual

Order Number: 317443-001US

27

Theory of Operation—Intel

®

945GME Express Chipset

3.4.2.11

Clocks

The Intel

®

945GME Express Chipset board uses a CK-410M and CK-SSCD compatible

solution. The CK-SSCD solution offers improved EMI performance by spreading the

radiated clock emissions over a wider spectrum than a single frequency. This is

accomplished while controlling the clock frequency deviation such that system

performance is not compromised. The FSB frequency is determined from decoding the

processor BSEL[2:0] pin settings.

3.4.2.12

Real Time Clock

An on-board battery at BT5H1 maintains power to the real time clock (RTC) when in a

mechanical off state. A CR2032 battery is installed on the Intel

®

945GME Express

Chipset development kit.

3.4.2.13

Thermal Monitoring

The processor has a thermal diode for temperature monitoring. The SMC thermal

monitoring device will throttle the processor if it becomes hot. If the temperature of the

processor rises too high, the SMC will alternately blink the CAPS lock and NUM lock

LEDs on the board, and the board will shut down.

3.4.3

System I/O and Connector Summary

The evaluation board provides extensive I/O capability in the form of internal

connectors and headers as detailed by the following list. For detailed information on

these connectors and headers, please refer to

“Hardware Reference” on page 35

.

• One (x16) PCI Express* connector
• Two (x1) PCI Express* connectors
• Two PCI connectors
• One IDE connector (supports two drives)
• Two SATA connectors
• Two USB ports via front panel header (J8J1)
• One LVDS video connector

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