Samsung M391B5773DH0 - Manual (Page 3)

- 3 -
datasheet
DDR3L SDRAM
Rev. 1.0
Unbuffered DIMM
Table Of Contents
240pin Unbuffered DIMM based on 2Gb D-die
1. DDR3L Unbuffered DIMM Ordering Information........................................................................................................... 4
2. Key Features................................................................................................................................................................. 4
3. Address Configuration .................................................................................................................................................. 4
4. x72 DIMM Pin Configurations (Front side/Back side) ................................................................................................... 5
5. Pin Description ............................................................................................................................................................. 6
6. SPD and Thermal Sensor for ECC UDIMMs ................................................................................................................ 6
7. Input/Output Functional Description.............................................................................................................................. 7
7.1 Address Mirroring Feature....................................................................................................................................... 8
7.1.1. DRAM Pin Wiring Mirroring .............................................................................................................................. 8
8. Function Block Diagram:............................................................................................................................................... 9
8.1 2GB, 256Mx72 ECC Module (Populated as 1 rank of x8 DDR3 SDRAMs) ............................................................ 9
8.2 4GB, 512Mx72 ECC Module (Populated as 2 ranks of x8 DDR3 SDRAMs)........................................................... 10
9. Absolute Maximum Ratings .......................................................................................................................................... 11
9.1 Absolute Maximum DC Ratings............................................................................................................................... 11
9.2 DRAM Component Operating Temperature Range ................................................................................................ 11
10. AC & DC Operating Conditions................................................................................................................................... 11
10.1 Recommended DC Operating Conditions (SSTL-15)............................................................................................ 11
11. AC & DC Input Measurement Levels .......................................................................................................................... 12
11.1 AC & DC Logic Input Levels for Single-ended Signals.......................................................................................... 12
11.2 V
REF
Tolerances.................................................................................................................................................... 14
11.3 AC and DC Logic Input Levels for Differential Signals .......................................................................................... 15
11.3.1. Differential Signals Definition ......................................................................................................................... 15
11.3.2. Differential Swing Requirement for Clock (CK - CK) and Strobe (DQS - DQS) ............................................. 15
11.3.3. Single-ended Requirements for Differential Signals ...................................................................................... 17
11.3.4. Differential Input Cross Point Voltage ............................................................................................................ 18
11.4 Slew Rate Definition for Single Ended Input Signals............................................................................................. 19
11.5 Slew rate definition for Differential Input Signals ................................................................................................... 19
12. AC & DC Output Measurement Levels ....................................................................................................................... 19
12.1 Single Ended AC and DC Output Levels............................................................................................................... 19
12.2 Differential AC and DC Output Levels ................................................................................................................... 19
12.3 Single-ended Output Slew Rate ............................................................................................................................ 20
12.4 Differential Output Slew Rate ................................................................................................................................ 21
13. IDD specification definition.......................................................................................................................................... 22
14. IDD SPEC Table ......................................................................................................................................................... 24
15. Input/Output Capacitance ........................................................................................................................................... 25
16. Electrical Characteristics and AC timing ..................................................................................................................... 26
16.1 Refresh Parameters by Device Density................................................................................................................. 26
16.2 Speed Bins and CL, tRCD, tRP, tRC and tRAS for Corresponding Bin ................................................................ 26
16.3 Speed Bins and CL, tRCD, tRP, tRC and tRAS for corresponding Bin ................................................................. 26
16.3.1. Speed Bin Table Notes .................................................................................................................................. 28
17. Timing Parameters by Speed Grade .......................................................................................................................... 30
17.1 Jitter Notes ............................................................................................................................................................ 33
17.2 Timing Parameter Notes........................................................................................................................................ 34
18. Physical Dimensions................................................................................................................................................... 35
18.1 256Mbx8 based 256Mx72 Module (1 Rank) - M391B5773DH0............................................................................ 35
18.2 256Mbx8 based 512Mx72 Module (2 Ranks) - M391B5273DH0 .......................................................................... 36