C&H Technology VS230LM06CS02CB - Manual (Page 2)

Document Number: 93835 For technical questions, contact: [email protected] www.vishay.com
Revision: 31-Mar-08 1
Fast Recovery Diodes
VS230LM06CS02CB
Vishay High Power Products
FEATURES
• 100 % tested at probe
• Bondable top metal
• Wafer in box, and die in chip carrier
Note
(1) Nitrogen flow on die edge
PRODUCT SUMMARY
Junction size Square 230 mils
Wafer size 4"
V
RRM
class 600 V
Passivation process Glassivated MOAT
Reference Vishay HPP
packaged part
40EPF Series
RoHS
COMPLIANT
MAJOR RATINGS AND CHARACTERISTICS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Maximum forward voltage V
FM
T
J
= 25 °C, I
F
= 20 A 1080 mV
Maximum repetitive reverse voltage V
RRM
(1) T
J
= 25 °C, I
RRM
= 100 µA 600 V
Reverse recovery time t
rr
T
J
= 25 °C, I
F
= 1 A, -dI/dt = 100 A/µs 60 ns
MECHANICAL DATA
Nominal back metal composition (thickness) Cr-Ni-Ag (1 kÅ - 4 kÅ - 6 kÅ)
Nominal front metal composition (thickness) 100 % Al (20 µm)
Chip dimensions 230 x 230 mils - see dimensions (link at the end of datasheet)
Wafer diameter 100 mm, with standard < 110 > flat
Wafer thickness 260 µm ± 10 µm
Maximum width of sawing line 45 µm
Reject ink dot size Ø 0.25 mm minimum
Ink dot location See dimensions (link at the end of datasheet)
Recommended storage environment Storage in original container, in desiccated nitrogen, with no contamination