Vishay high power products, Fast recovery diodes – C&H Technology VS230LM06CS02CB User Manual
Page 3
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Document Number: 93835
2
Revision: 31-Mar-08
VS230LM06CS02CB
Vishay High Power Products
Fast Recovery Diodes
ORDERING INFORMATION TABLE
Device code
1
-
Vishay HPP device
2
-
Chip dimension in mils
3
-
Type of device: L = Wire bondable fast recovery diode
4
-
Passivation process: M = Glassivated MOAT
5
-
Voltage code x 100 = V
RRM
6
-
Metallization: C = Aluminum (anode) - silver (cathode)
7
-
t
rr
code: S02 = 60 ns
8
-
CB = Probed uncut die (wafer in box)
None = Probed die in chip carrier
5
1
3
2
4
6
7
8
VS
230
L
M
06
C
S02
CB
LINKS TO RELATED DOCUMENTS
Dimensions
http://www.vishay.com/doc?95125
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