Vishay semiconductors – C&H Technology VS-UFL230FA60 User Manual

Page 3

Advertising
background image

VS-UFL230FA60

www.vishay.com

Vishay Semiconductors

Revision: 03-Nov-11

2

Document Number: 93635

For technical questions within your region:

[email protected]

,

[email protected]

,

[email protected]

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

www.vishay.com/doc?91000

ELECTRICAL SPECIFICATIONS PER DIODE (T

J

= 25 °C unless otherwise specified)

PARAMETER

SYMBOL

TEST CONDITIONS MIN.

TYP.

MAX.

UNITS

Cathode to anode breakdown voltage

V

BR

I

R

= 100 μA

600

-

-

V

Forward voltage

V

FM

I

F

= 100 A

-

1.28

1.44

I

F

= 100 A, T

J

= 125 °C

-

1.13

1.24

I

F

= 200 A

-

1.48

1.66

I

F

= 200 A, T

J

= 125 °C

-

1.37

1.55

Reverse leakage current

I

RM

V

R

= V

R

rated

-

0.1

50

μA

T

J

= 175 °C, V

R

= V

R

rated

-

0.25

2

mA

Junction capacitance

C

T

V

R

= 600 V

-

72

-

pF

DYNAMIC RECOVERY CHARACTERISTICS (T

J

= 25 °C unless otherwise specified)

PARAMETER SYMBOL

TEST

CONDITIONS

MIN.

TYP.

MAX.

UNITS

Reverse recovery time

t

rr

I

F

= 1.0 A, dI

F

/dt = 200 A/μs, V

R

= 30 V

-

44

-

ns

T

J

= 25 °C

I

F

= 50 A

dI

F

/dt = 200 A/μs

V

R

= 200 V

-

104

-

T

J

= 125 °C

-

210

-

Peak recovery current

I

RRM

T

J

= 25 °C

-

10

-

A

T

J

= 125 °C

-

22

-

Reverse recovery charge

Q

rr

T

J

= 25 °C

-

520

-

nC

T

J

= 125 °C

-

2200

-

THERMAL - MECHANICAL SPECIFICATIONS

PARAMETER SYMBOL

TEST

CONDITIONS

MIN. TYP. MAX.

UNITS

Junction to case, single leg conducting

R

thJC

-

-

0.43

°C/W

Junction to case, both leg conducting

-

-

0.215

Case to heatsink

R

thCS

Flat, greased surface

-

0.05

-

Weight

-

30

-

g

Mounting torque

-

1.3

-

Nm

Case style

SOT-227

Advertising