Vishay semiconductors, Igbt electrical specifications (t, Switching characteristics – C&H Technology VS-GB200TH120N User Manual

Page 3: Diode electrical specifications (t

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VS-GB200TH120N

www.vishay.com

Vishay Semiconductors

Revision: 17-Sep-12

2

Document Number: 94763

For technical questions within your region:

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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

www.vishay.com/doc?91000

IGBT ELECTRICAL SPECIFICATIONS (T

C

= 25 °C unless otherwise noted)

PARAMETER

SYMBOL

TEST CONDITIONS MIN.

TYP.

MAX.

UNITS

Collector to emitter breakdown voltage

V

(BR)CES

T

J

= 25 °C

1200

-

-

V

Collector to emitter voltage

V

CE(on)

V

GE

= 15 V, I

C

= 200 A, T

J

= 25 °C

-

1.90

2.35

V

GE

= 15 V, I

C

= 200 A, T

J

= 125 °C

-

2.10

-

Gate to emitter threshold voltage

V

GE(th)

V

CE

= V

GE

, I

C

= 8.0 mA, T

J

= 25 °C

5.0

6.2

7.0

Collector cut-off current

I

CES

V

CE

= V

CES

, V

GE

= 0 V, T

J

= 25 °C

-

-

5.0

mA

Gate to emitter leakage current

I

GES

V

GE

= V

GES

, V

CE

= 0 V, T

J

= 25 °C

-

-

400

nA

SWITCHING CHARACTERISTICS

PARAMETER

SYMBOL

TEST CONDITIONS MIN.

TYP.

MAX.

UNITS

Turn-on delay time

t

d(on)

V

CC

= 600 V, I

C

= 200 A, R

g

= 5.1

,

V

GE

= ± 15 V, T

J

= 25 °C

-

437

-

ns

Rise time

t

r

-

75

-

Turn-off delay time

t

d(off)

-

436

-

Fall time

t

f

-

165

-

Turn-on switching loss

E

on

-

10.0

-

mJ

Turn-off switching loss

E

off

-

15.0

-

Turn-on delay time

t

d(on)

V

CC

= 600 V, I

C

= 200 A, R

g

= 5.1

,

V

GE

= ± 15 V, T

J

= 125 °C

-

445

-

ns

Rise time

t

r

-

96

-

Turn-off delay time

t

d(off)

-

488

-

Fall time

t

f

-

258

-

Turn-on switching loss

E

on

-

15.9

-

mJ

Turn-off switching loss

E

off

-

22.3

-

Input capacitance

C

ies

V

GE

= 0 V, V

CE

= 25 V, f = 1.0 MHz

-

14.9

-

nF

Output capacitance

C

oes

-

1.04

-

Reverse transfer capacitance

C

res

-

0.68

-

SC data

I

SC

t

sc

 10 μs, V

GE

= 15 V, T

J

= 125 °C,

V

CC

= 900 V, V

CEM

 1200 V

-

1200

-

A

Internal gate resistance

R

gint

-

1.0

-

Stray inductance

L

CE

-

-

20

nH

Module lead resistance, terminal to chip

R

CC’+EE’

T

C

= 25 °C

-

0.35

-

m

DIODE ELECTRICAL SPECIFICATIONS (T

C

= 25 °C unless otherwise noted)

PARAMETER

SYMBOL

TEST CONDITIONS

MIN.

TYP.

MAX.

UNITS

Diode forward voltage

V

F

I

F

= 200 A

T

J

= 25 °C

-

1.82

2.25

V

T

J

= 125 °C

-

1.95

-

Diode reverse recovery charge

Q

rr

I

F

= 200 A, V

R

= 600 V,

dI/dt = - 2370 A/μs,
V

GE

= - 15 V

T

J

= 25 °C

-

16.6

-

μC

T

J

= 125 °C

-

29.2

-

Diode peak reverse recovery current

I

rr

T

J

= 25 °C

-

156

-

A

T

J

= 125 °C

-

210

-

Diode reverse recovery energy

E

rec

T

J

= 25 °C

-

9.3

-

mJ

T

J

= 125 °C

-

16.0

-

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