Vs-sa61ba60, Vishay semiconductors, Forward conduction – C&H Technology VS-SA61BA60 User Manual

Page 3: Recovery characteristics, Thermal and mechanical specifications

Advertising
background image

VS-SA61BA60

www.vishay.com

Vishay Semiconductors

Revision: 29-Feb-12

2

Document Number: 94688

For technical questions within your region:

[email protected]

,

[email protected]

,

[email protected]

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

www.vishay.com/doc?91000

FORWARD CONDUCTION

PARAMETER

SYMBOL

TEST CONDITIONS

VALUES

UNITS

Maximum DC output current
at case temperature

I

O

Resistive or inductive load

61

A

57

°C

Maximum peak, one-cycle
non-repetitive forward current

I

FSM

t = 10 ms

No voltage
reapplied

Initial T

J

=

T

J

maximum

300

A

t = 8.3 ms

310

t = 10 ms

100 % V

RRM

reapplied

250

t = 8.3 ms

260

Maximum I

2

t for fusing

I

2

t

t = 10 ms

No voltage
reapplied

442

A

2

s

t = 8.3 ms

402

t = 10 ms

100 % V

RRM

reapplied

313

t = 8.3 ms

284

Maximum I

2

t for fusing

I

2

t

I

2

t for time t

x

= I

2

t x t

x

0.1  t

x

 10 ms, V

RRM

= 0 V

4.4

kA

2

s

Value of threshold voltage

V

F(TO)

T

J

maximum

0.914

V

Forward slope resistance

r

t

10.5

m

Maximum forward voltage drop

V

FM

T

J

= 25 °C, I

FM

= 30 A

pk

t

p

= 400 μs

1.33

V

T

J

= T

J

maximum, I

FM

= 30 A

pk

1.23

RMS isolation voltage base plate

V

INS

f = 50 Hz, t = 1 s

3000

RECOVERY CHARACTERISTICS

PARAMETER

SYMB

OL

TEST CONDITIONS

VALUES

UNITS

Reverse recovery time, typical

t

rr

T

J

= 25 °C, I

F

= 20 A, V

R

= 30 V,

dI

F

/dt = 100 A/μs

170

ns

T

J

= 125 °C, I

F

= 20 A, V

R

= 30 V,

dI

F

/dt = 100 A/μs

250

Reverse recovery current,
typical

I

rr

T

J

= 25 °C, I

F

= 20 A, V

R

= 30 V,

dI

F

/dt = 100 A/μs

10.5

A

T

J

= 125 °C, I

F

= 20 A, V

R

= 30 V,

dI

F

/dt = 100 A/μs

16

Reverse recovery charge,
typical

Q

rr

T

J

= 25 °C, I

F

= 20 A, V

R

= 30 V,

dI

F

/dt = 100 A/μs

900

nC

T

J

= 125 °C, I

F

= 20 A, V

R

= 30 V,

dI

F

/dt = 100 A/μs

1970

Snap factor, typical

S

T

J

= 25 °C

0.6

-

Junction capacitance, typical

C

T

V

R

= 600 V

67

pF

THERMAL AND MECHANICAL SPECIFICATIONS

PARAMETER

SYMBOL

TEST CONDITIONS

VALUES

UNITS

Junction and storage
temperature range

T

J

, T

Stg

- 55 to 150

°C

Maximum thermal resistance
junction to case per bridge

R

thJC

0.30

°C/W

Typical thermal resistance,
case to heatsink per module

R

thCS

Mounting surface, smooth, flat and greased

0.05

Approximate weight

30

g

Mounting torque ± 10 %

Bridge to heatsink

1.3

Nm

Case style

SOT-227

I

FM

t

rr

dI

R

dt

I

RM(REC)

Q

rr

t

Advertising