Vishay semiconductors, Igbt electrical specifications (t, Switching characteristics – C&H Technology VS-GT400TH120N User Manual

Page 3: Diode electrical specifications (t

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VS-GT400TH120N

www.vishay.com

Vishay Semiconductors

Revision: 17-Sep-12

2

Document Number: 94748

For technical questions within your region:

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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

www.vishay.com/doc?91000

IGBT ELECTRICAL SPECIFICATIONS (T

C

= 25 °C unless otherwise noted)

PARAMETER

SYMBOL

TEST CONDITIONS MIN.

TYP.

MAX.

UNITS

Collector to emitter breakdown voltage

V

(BR)CES

T

J

= 25 °C

1200

-

-

V

Collector to emitter voltage

V

CE(on)

V

GE

= 15 V, I

C

= 400 A, T

J

= 25 °C

-

1.70

2.15

V

GE

= 15 V, I

C

= 400 A, T

J

= 125 °C

-

2.0

-

Gate to emitter threshold voltage

V

GE(th)

V

CE

= V

GE

, I

C

= 16 mA, T

J

= 25 °C

5.0

5.8

6.5

Collector cut-off current

I

CES

V

CE

= V

CES

, V

GE

= 0 V, T

J

= 25 °C

-

-

5.0

mA

Gate to emitter leakage current

I

GES

V

GE

= V

GES

, V

CE

= 0 V, T

J

= 25 °C

-

-

400

nA

SWITCHING CHARACTERISTICS

PARAMETER

SYMBOL

TEST CONDITIONS MIN.

TYP.

MAX.

UNITS

Turn-on delay time

t

d(on)

V

CC

= 600 V, I

C

= 400 A, R

g

= 1.8

,

V

GE

= ± 15 V, T

J

= 25 °C

-

250

-

ns

Rise time

t

r

-

39

-

Turn-off delay time

t

d(off)

-

500

-

Fall time

t

f

-

100

-

Turn-on switching loss

E

on

-

17.0

-

mJ

Turn-off switching loss

E

off

-

42.0

-

Turn-on delay time

t

d(on)

V

CC

= 600 V, I

C

= 400 A, R

g

= 1.8

,

V

GE

= ± 15 V, T

J

= 125 °C

-

299

-

ns

Rise time

t

r

-

46

-

Turn-off delay time

t

d(off)

-

605

-

Fall time

t

f

-

155

-

Turn-on switching loss

E

on

-

25.1

-

mJ

Turn-off switching loss

E

off

-

61.9

-

Input capacitance

C

ies

V

GE

= 0 V, V

CE

= 25 V, f = 1.0 MHz

-

28.8

-

nF

Output capacitance

C

oes

-

1.51

-

Reverse transfer capacitance

C

res

-

1.31

-

SC data

I

SC

t

sc

 10 μs, V

GE

= 15 V, T

J

= 125 °C,

V

CC

= 600 V, V

CEM

 1200 V

-

1600

-

A

Internal gate resistance

R

gint

-

1.9

-

Stray inductance

L

CE

-

-

20

nH

Module lead resistance, terminal to chip

R

CC’+EE’

T

C

= 25 °C

-

0.35

-

m

DIODE ELECTRICAL SPECIFICATIONS (T

C

= 25 °C unless otherwise noted)

PARAMETER

SYMBOL

TEST CONDITIONS

MIN.

TYP.

MAX.

UNITS

Diode forward voltage

V

F

I

F

= 400 A

T

J

= 25 °C

-

1.65

2.15

V

T

J

= 125 °C

-

1.65

-

Diode reverse recovery charge

Q

rr

I

F

= 400 A, V

R

= 600 V,

dI/dt = - 6000 A/μs,
V

GE

= - 15 V

T

J

= 25 °C

-

44

-

μC

T

J

= 125 °C

-

78

-

Diode peak reverse recovery current

I

rr

T

J

= 25 °C

-

490

-

A

T

J

= 125 °C

-

555

-

Diode reverse recovery energy

E

rec

T

J

= 25 °C

-

19.0

-

mJ

T

J

= 125 °C

-

35.1

-

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