Vishay semiconductors, Thermal and mechanical specifications – C&H Technology GT100DA60U User Manual

Page 4

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GT100DA60U

www.vishay.com

Vishay Semiconductors

Revision: 24-Oct-12

3

Document Number: 93185

For technical questions within your region:

[email protected]

,

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,

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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

www.vishay.com/doc?91000

Fig. 1 - Maximum DC IGBT Collector Current vs.

Case Temperature

Fig. 2 - IGBT Reverse Bias SOA

T

J

= 175 °C, V

GE

= 15 V

Fig. 3 - Typical IGBT Collector Current Characteristics

V

GE

= 15 V

Fig. 4 - Maximum DC Forward Current vs.

Case Temperature

THERMAL AND MECHANICAL SPECIFICATIONS

PARAMETER

SYMBOL

MIN. TYP. MAX.

UNITS

Maximum junction and storage temperature range

T

J

, T

Stg

- 40

-

175

°C

Junction to case

IGBT

R

thJC

-

-

0.26

°C/W

Diode

-

-

0.73

Case to sink per module

R

thCS

-

0.05

-

Mounting torque, 6-32 or M3 screw

-

-

1.3

Nm

Weight

-

30

-

g

Allowable Case Temperature (°C)

I

C

- Continuous Collector Current (A)

0

93185_01

20

40

60

100

140

180

80

120

160

200

0

180

160

100

120

140

20

40

60

80

I

C

(A)

V

CE

(V)

1

10

100

1000

0.01

0.1

1

93185_02

1000

10

100

I

C

(A)

V

CE

(V)

0

4.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

0

93185_02

300

100

200

275

75

175

250

50

150

225

25

125

T

J

= 175 °C

T

J

= 125 °C

T

J

= 25 °C

Allowable Case Temperature (°C)

I

F

- Continuous Forward Current (A)

80

60

40

20

100

120

0

100

160

180

0

40

60

140

80

120

20

93185_04

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